Inventor · disambiguated record
Tien-Yu Huang
Also filed as: HUANG TIEN-YU
24 granted patents·5 pending applications·100 citations·filing 2000–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17HACKSAW & KNIFE MANUFACTORY CO LTD4TAIWAN SEMICONDUCTOR MFG3Orange Hardware Company2HACK SAW & KNIFE MANUFACTORY CO LTD1
Top patents by PatentIndex Score
29 records- 0197US10267988B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·24 cites·20 claims
- 0295US11694939B2Semiconductor package, integrated optical communication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 4, 2023·4 cites·20 claims
- 0394US11764123B2Semiconductor package, integrated optical communication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·2 cites·20 claims
- 0493US10459159B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 29, 2019·7 cites·20 claims
- 0589US9419156B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·6 cites·18 claims
- 0688US11150404B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·4 cites·20 claims
- 0788US10245736B2Automatically retractable cutterOrange Hardware Company·Filed 2017·Granted Apr 2, 2019·12 cites·14 claims
- 0884US10276471B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 0984US9478475B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·3 cites·20 claims
- 1082US10748825B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·2 cites·20 claims
- 1180US12419583B2Heart rate measurement using adaptive harmonics filteringUNIV FLORIDA·Filed 2024·Granted Sep 23, 2025·0 cites·15 claims
- 1280US9099623B2Manufacture including substrate and package structure of optical chipTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·3 cites·21 claims
- 1377US2024418932A1Photonic silicon spatial beam transformer integrated on 3dic package and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1472US12124078B2Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 1570US9902092B2Vacuum carrier module, method of using and process of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 27, 2018·2 cites·19 claims
- 1667USD751883SBox cutterHACKSAW & KNIFE MANUFACTORY CO LTD·Filed 2015·Granted Mar 22, 2016·14 cites·1 claims
- 1765US11243353B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 1864US6299482B1Digital connector retaining deviceFiled 2000·Granted Oct 9, 2001·15 cites·5 claims
- 1958US9865481B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·0 cites·20 claims
- 2058US9354390B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·0 cites·20 claims
- 2157US9799528B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·0 cites·20 claims
- 2255US10527791B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 7, 2020·0 cites·20 claims
- 2355US10137603B2Vacuum carrier module, method of using and process of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 27, 2018·0 cites·20 claims
- 2455US9264569B2Optical scanner integrated with substrate method of making and method of using the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·0 cites·20 claims
- 2554US12172333B2Utility knifeOrange Hardware Company·Filed 2022·Granted Dec 24, 2024·0 cites·7 claims
- 2649US2016089732A1Hand sawHACKSAW & KNIFE MANUFACTORY CO LTD·Filed 2014·Application pending·0 cites
- 2741US2016250698A1Bow SawHACK SAW & KNIFE MANUFACTORY CO LTD·Filed 2015·Application pending·0 cites
- 2837US2016288343A1Box cutter structureHACKSAW & KNIFE MANUFACTORY CO LTD·Filed 2015·Application pending·0 cites
- 2937US2016279811A1Box cutter structureHACKSAW & KNIFE MANUFACTORY CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →