Inventor · disambiguated record
Rezaur Rahman Khan
Also filed as: KHAN REZAUR R · KHAN REZAUR RAHMAN
59 granted patents·19 pending applications·926 citations·filing 2005–2018
99Inventor score
Files withBROADCOM CORP41ZHAO SAM ZIQUN13KHAN REZAUR RAHMAN7AVAGO TECHNOLOGIES GENERAL IP4KARIKALAN SAMPATH K V3
Top patents by PatentIndex Score
78 records- 0199US8508045B2Package 3D interconnection and method of making sameKHAN REZAUR RAHMAN·Filed 2011·Granted Aug 13, 2013·88 cites·22 claims
- 0298US8823144B2Semiconductor package with interface substrate having interposerBROADCOM CORP·Filed 2013·Granted Sep 2, 2014·33 cites·14 claims
- 0398US7808087B2Leadframe IC packages having top and bottom integrated heat spreadersBROADCOM CORP·Filed 2006·Granted Oct 5, 2010·97 cites·30 claims
- 0498US7714453B2Interconnect structure and formation for package stacking of molded plastic area array packageBROADCOM CORP·Filed 2007·Granted May 11, 2010·89 cites·22 claims
- 0598US7202559B2Method of assembling a ball grid array package with patterned stiffener layerBROADCOM CORP·Filed 2005·Granted Apr 10, 2007·68 cites·16 claims
- 0697US9431371B2Semiconductor package with a bridge interposerBROADCOM CORP·Filed 2015·Granted Aug 30, 2016·20 cites·21 claims
- 0797US8558395B2Organic interface substrate having interposer with through-semiconductor viasKHAN REZAUR RAHMAN·Filed 2012·Granted Oct 15, 2013·38 cites·13 claims
- 0897US7462933B2Ball grid array package enhanced with a thermal and electrical connectorBROADCOM CORP·Filed 2006·Granted Dec 9, 2008·35 cites·11 claims
- 0996US8718550B2Interposer package structure for wireless communication element, thermal enhancement, and EMI shieldingZHAO SAM ZIQUN·Filed 2011·Granted May 6, 2014·22 cites·26 claims
- 1096US7872335B2Lead frame-BGA package with enhanced thermal performance and I/O countsBROADCOM CORP·Filed 2007·Granted Jan 18, 2011·53 cites·22 claims
- 1195US9059179B2Semiconductor package with a bridge interposerKARIKALAN SAMPATH K V·Filed 2011·Granted Jun 16, 2015·27 cites·20 claims
- 1295US9013035B2Thermal improvement for hotspots on dies in integrated circuit packagesZHAO SAM ZIQUN·Filed 2006·Granted Apr 21, 2015·24 cites·20 claims
- 1395US8928128B2Semiconductor package with integrated electromagnetic shieldingKARIKALAN SAMPATH K V·Filed 2012·Granted Jan 6, 2015·37 cites·20 claims
- 1495US8587132B2Semiconductor package including an organic substrate and interposer having through-semiconductor viasBROADCOM CORP·Filed 2012·Granted Nov 19, 2013·15 cites·20 claims
- 1594US8367475B2Chip scale package assembly in reconstitution panel process formatBROADCOM CORP·Filed 2011·Granted Feb 5, 2013·31 cites·20 claims
- 1693US10008439B2Thin recon interposer package without TSV for fine input/output pitch fan-outAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jun 26, 2018·10 cites·20 claims
- 1793US7566590B2Low voltage drop and high thermal performance ball grid array packageBROADCOM CORP·Filed 2007·Granted Jul 28, 2009·24 cites·12 claims
- 1891US9236442B2Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connectionsBROADCOM CORP·Filed 2012·Granted Jan 12, 2016·13 cites·20 claims
- 1991US8581381B2Integrated circuit (IC) package stacking and IC packages formed by sameZHAO SAM ZIQUN·Filed 2006·Granted Nov 12, 2013·22 cites·23 claims
- 2091US7618849B2Integrated circuit package with etched leadframe for package-on-package interconnectsBROADCOM CORP·Filed 2007·Granted Nov 17, 2009·20 cites·10 claims
- 2191US7579217B2Methods of making a die-up ball grid array package with printed circuit board attachable heat spreaderBROADCOM CORP·Filed 2006·Granted Aug 25, 2009·11 cites·18 claims
- 2288US9406636B2Interposer package-on-package structureBROADCOM CORP·Filed 2015·Granted Aug 2, 2016·5 cites·20 claims
- 2387US8872321B2Semiconductor packages with integrated heat spreadersZHAO SAM ZIQUN·Filed 2012·Granted Oct 28, 2014·9 cites·20 claims
- 2487US8269323B2Integrated circuit package with etched leadframe for package-on-package interconnectsKHAN REZAUR RAHMAN·Filed 2009·Granted Sep 18, 2012·13 cites·20 claims
- 2585US9070627B2Interposer package-on-package structureBROADCOM CORP·Filed 2013·Granted Jun 30, 2015·6 cites·22 claims
- 2684US10615110B2Thin recon interposer package without TSV for fine input/output pitch fan-outAVAGO TECH INT SALES PTE LID·Filed 2018·Granted Apr 7, 2020·3 cites·20 claims
- 2784US8749072B2Semiconductor package with integrated selectively conductive film interposerZHAO SAM ZIQUN·Filed 2012·Granted Jun 10, 2014·7 cites·20 claims
- 2884US8587123B2Multi-chip and multi-substrate reconstitution based packagingLAW EDWARD·Filed 2011·Granted Nov 19, 2013·9 cites·20 claims
- 2984US8183680B2No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancementZHAO SAM ZIQUN·Filed 2006·Granted May 22, 2012·12 cites·49 claims
- 3083US9548251B2Semiconductor interposer having a cavity for intra-interposer dieKHAN REZAUR RAHMAN·Filed 2012·Granted Jan 17, 2017·7 cites·28 claims
- 3183US9013041B2Semiconductor package with ultra-thin interposer without through-semiconductor viasKARIKALAN SAMPATH K V·Filed 2011·Granted Apr 21, 2015·7 cites·18 claims
- 3283US8183687B2Interposer for die stacking in semiconductor packages and the method of making the sameKHAN REZAUR RAHMAN·Filed 2007·Granted May 22, 2012·11 cites·24 claims
- 3381US9230875B2Interposer package structure for wireless communication element, thermal enhancement, and EMI shieldingBROADCOM CORP·Filed 2014·Granted Jan 5, 2016·4 cites·20 claims
- 3481US8417200B1Wideband power efficient high transmission power radio frequency (RF) transmitterGOMEZ RAY RAMON·Filed 2011·Granted Apr 9, 2013·6 cites·22 claims
- 3580US9129980B2Package 3D interconnection and method of making sameBROADCOM CORP·Filed 2013·Granted Sep 8, 2015·4 cites·20 claims
- 3680US8829656B2Semiconductor package including interposer with through-semiconductor viasBROADCOM CORP·Filed 2013·Granted Sep 9, 2014·3 cites·18 claims
- 3778US8664772B2Interface substrate with interposerBROADCOM CORP·Filed 2013·Granted Mar 4, 2014·3 cites·10 claims
- 3877US9693461B2Magnetic-core three-dimensional (3D) inductors and packaging integrationBROADCOM CORP·Filed 2015·Granted Jun 27, 2017·3 cites·24 claims
- 3977US9024436B2Thermal interface material for integrated circuit packageBROADCOM CORP·Filed 2013·Granted May 5, 2015·3 cites·20 claims
- 4074US9299634B2Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packagesKHAN REZAUR RAHMAN·Filed 2006·Granted Mar 29, 2016·5 cites·24 claims
- 4173US9064781B2Package 3D interconnection and method of making sameZHAO SAM ZIQUN·Filed 2012·Granted Jun 23, 2015·3 cites·22 claims
- 4273US8791533B2Semiconductor package having an interposer configured for magnetic signalingCHEN XIANGDONG·Filed 2012·Granted Jul 29, 2014·3 cites·20 claims
- 4372US9275976B2System-in-package with integrated socketZHAO SAM ZIQUN·Filed 2012·Granted Mar 1, 2016·3 cites·20 claims
- 4471US9338880B2Mutual capacitance and magnetic field distribution control for transmission linesKARIKALAN SAMPATH KOMARAPALAYAM VELAYUDHAM·Filed 2012·Granted May 10, 2016·2 cites·20 claims
- 4570US8169067B2Low profile ball grid array (BGA) package with exposed die and method of making sameLAW EDWARD·Filed 2006·Granted May 1, 2012·5 cites·14 claims
- 4669US8039949B2Ball grid array package having one or more stiffenersBROADCOM CORP·Filed 2009·Granted Oct 18, 2011·2 cites·25 claims
- 4768US8829655B2Semiconductor package including a substrate and an interposerBROADCOM CORP·Filed 2013·Granted Sep 9, 2014·1 cites·20 claims
- 4864US10079191B2Heat spreader having thermal interface material retainmentAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Sep 18, 2018·1 cites·20 claims
- 4963US9837378B2Fan-out 3D IC integration structure without substrate and method of making the sameAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Dec 5, 2017·1 cites·12 claims
- 5063US8102027B2IC package sacrificial structures for crack propagation confinementZHAO SAM ZIQUN·Filed 2008·Granted Jan 24, 2012·2 cites·32 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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