Assignee
ZHAO SAM ZIQUN
US·17 granted patents·4 pending applications·148 citations·filing 2006–2012
Top patents by PatentIndex Score
21 records- 0196US8718550B2Interposer package structure for wireless communication element, thermal enhancement, and EMI shieldingZHAO SAM ZIQUN·Filed 2011·Granted May 6, 2014·22 cites·26 claims
- 0295US9013035B2Thermal improvement for hotspots on dies in integrated circuit packagesZHAO SAM ZIQUN·Filed 2006·Granted Apr 21, 2015·24 cites·20 claims
- 0393US8310067B2Ball grid array package enhanced with a thermal and electrical connectorZHAO SAM ZIQUN·Filed 2011·Granted Nov 13, 2012·12 cites·19 claims
- 0493US8213180B2Electromagnetic interference shield with integrated heat sinkZHAO SAM ZIQUN·Filed 2010·Granted Jul 3, 2012·20 cites·19 claims
- 0591US8686558B2Thermally and electrically enhanced ball grid array packageZHAO SAM ZIQUN·Filed 2011·Granted Apr 1, 2014·9 cites·20 claims
- 0691US8581381B2Integrated circuit (IC) package stacking and IC packages formed by sameZHAO SAM ZIQUN·Filed 2006·Granted Nov 12, 2013·22 cites·23 claims
- 0787US8872321B2Semiconductor packages with integrated heat spreadersZHAO SAM ZIQUN·Filed 2012·Granted Oct 28, 2014·9 cites·20 claims
- 0884US8749072B2Semiconductor package with integrated selectively conductive film interposerZHAO SAM ZIQUN·Filed 2012·Granted Jun 10, 2014·7 cites·20 claims
- 0984US8183680B2No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancementZHAO SAM ZIQUN·Filed 2006·Granted May 22, 2012·12 cites·49 claims
- 1073US9064781B2Package 3D interconnection and method of making sameZHAO SAM ZIQUN·Filed 2012·Granted Jun 23, 2015·3 cites·22 claims
- 1172US9275976B2System-in-package with integrated socketZHAO SAM ZIQUN·Filed 2012·Granted Mar 1, 2016·3 cites·20 claims
- 1267US8928139B2Device having wirelessly enabled functional blocksZHAO SAM ZIQUN·Filed 2011·Granted Jan 6, 2015·2 cites·20 claims
- 1363US8102027B2IC package sacrificial structures for crack propagation confinementZHAO SAM ZIQUN·Filed 2008·Granted Jan 24, 2012·2 cites·32 claims
- 1462US9153507B2Semiconductor package with improved testabilityZHAO SAM ZIQUN·Filed 2012·Granted Oct 6, 2015·1 cites·20 claims
- 1544US8901945B2Test board for use with devices having wirelessly enabled functional blocks and method of using sameZHAO SAM ZIQUN·Filed 2011·Granted Dec 2, 2014·0 cites·20 claims
- 1643US9041171B2Programmable interposer with conductive particlesZHAO SAM ZIQUN·Filed 2011·Granted May 26, 2015·0 cites·21 claims
- 1743US8817472B2Methods and systems for on-chip osmotic airflow coolingZHAO SAM ZIQUN·Filed 2011·Granted Aug 26, 2014·0 cites·21 claims
- 1841US2013214408A1Interposer Having Conductive PostsZHAO SAM ZIQUN·Filed 2012·Application pending·0 cites
- 1939US2012086114A1Millimeter devices on an integrated circuitZHAO SAM ZIQUN·Filed 2011·Application pending·0 cites
- 2039US2012126396A1Die down device with thermal connectorZHAO SAM ZIQUN·Filed 2010·Application pending·0 cites
- 2139US2011316139A1Package for a wireless enabled integrated circuitZHAO SAM ZIQUN·Filed 2011·Application pending·0 cites
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