Inventor · disambiguated record
Teh-Tien Su
Also filed as: SU TEH-TIEN
4 granted patents·5 pending applications·62 citations·filing 2006–2021
79Inventor score
Top patents by PatentIndex Score
9 records- 0198US11069535B2Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2020·Granted Jul 20, 2021·7 cites·19 claims
- 0297US9972504B2Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2015·Granted May 15, 2018·21 cites·19 claims
- 0389US7276447B1Plasma dielectric etch process including ex-situ backside polymer removal for low-dielectric constant materialAPPLIED MATERIALS INC·Filed 2006·Granted Oct 2, 2007·24 cites·18 claims
- 0479US8083963B2Removal of process residues on the backside of a substrateDELGADINO GERARDO A·Filed 2007·Granted Dec 27, 2011·10 cites·24 claims
- 0574US2022115244A1Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 0672US2021305059A1Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2021·Application pending·0 cites
- 0758US2018240682A1Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2018·Application pending·0 cites
- 0844US2010003828A1Methods for adjusting critical dimension uniformity in an etch process with a highly concentrated unsaturated hydrocarbon gasDING GUOWEN·Filed 2007·Application pending·0 cites
- 0935US2012094499A1Method of performing an in situ chamber cleanNG SIU TANG·Filed 2011·Application pending·0 cites
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