Inventor · disambiguated record
Kyoung-Moon Kang
Also filed as: KANG KYOUNG M · KANG KYOUNG-MOON
12 granted patents·7 pending applications·114 citations·filing 2002–2012
90Inventor score
Top patents by PatentIndex Score
19 records- 0194US7261621B2Pad conditioner for chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 28, 2007·52 cites·23 claims
- 0290US8734206B2Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus including the sameCHANG ONE-MOON·Filed 2011·Granted May 27, 2014·21 cites·11 claims
- 0383US7442111B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 28, 2008·8 cites·18 claims
- 0477US8314028B2Slurry compositions and methods of polishing a layer using the slurry compositionsHONG GI-SIK·Filed 2007·Granted Nov 20, 2012·9 cites·21 claims
- 0574US7229337B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 12, 2007·14 cites·11 claims
- 0669US7429367B2Method for producing improved cerium oxide abrasive particles and compositions including such particlesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 30, 2008·3 cites·37 claims
- 0766US7662022B2Polishing pad, platen, method of monitoring, method of manufacturing, and method of detectingSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 16, 2010·2 cites·10 claims
- 0866US7402261B2Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 22, 2008·2 cites·23 claims
- 0964US7578727B2Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 25, 2009·2 cites·24 claims
- 1054US8007676B2Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·0 cites·15 claims
- 1150US7858527B2Additive composition, slurry composition including the same, and method of polishing an object using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 28, 2010·0 cites·14 claims
- 1245US7288212B2Additive composition, slurry composition including the same, and method of polishing an object using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 30, 2007·1 cites·8 claims
- 1344US2009042494A1Pad conditioner of semiconductor wafer polishing apparatus and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1443US2007148978A1Slurry compositions, methods of polishing polysilicon layers using the slurry compositions and methods of manufacturing semiconductor devices using the slurry compositionsHAN EUI-JIN·Filed 2006·Application pending·0 cites
- 1542US2007037486A1Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing padKANG KYOUNG-MOON·Filed 2006·Application pending·0 cites
- 1640US2006032147A1Method of preparing slurry composition for chemical mechanical polishingSO JAE-HYUN·Filed 2005·Application pending·0 cites
- 1740US2006032150A1Method for producing improved cerium oxide abrasive particles and compositions including such particlesSO JAE H·Filed 2005·Application pending·0 cites
- 1838US2013112914A1Slurry Composition For Polishing And Method Of Manufacturing Phase Change Memory Device Using The SameHAN CHOONG-HO·Filed 2012·Application pending·0 cites
- 1934US2004023491A1Preparation and use of an abrasive slurry compositionFiled 2003·Application pending·0 cites
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