Inventor · disambiguated record
Varaprasad V. Calmidi
Also filed as: CALMIDI VARAPRASAD V · CALMIDI VARAPRASAD VENKATA
15 granted patents·1 pending application·494 citations·filing 2001–2011
94Inventor score
Top patents by PatentIndex Score
16 records- 0196US6665187B1Thermally enhanced lid for multichip modulesIBM·Filed 2002·Granted Dec 16, 2003·108 cites·18 claims
- 0296US6665186B1Liquid metal thermal interface for an electronic moduleIBM·Filed 2002·Granted Dec 16, 2003·138 cites·22 claims
- 0391US7261466B2Imaging inspection apparatus with directional coolingENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 28, 2007·16 cites·20 claims
- 0490US7629684B2Adjustable thickness thermal interposer and electronic package utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Dec 8, 2009·20 cites·19 claims
- 0590US6631078B2Electronic package with thermally conductive standoffIBM·Filed 2002·Granted Oct 7, 2003·62 cites·17 claims
- 0689US7851906B2Flexible circuit electronic package with standoffsENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Dec 14, 2010·19 cites·24 claims
- 0789US7510912B2Method of making wirebond electronic package with enhanced chip pad designENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·17 cites·6 claims
- 0888US7354197B2Imaging inspection apparatus with improved coolingENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 8, 2008·10 cites·20 claims
- 0986US6622786B1Heat sink structure with pyramidic and base-plate cut-outsIBM·Filed 2002·Granted Sep 23, 2003·45 cites·18 claims
- 1085US7510324B2Method of inspecting articles using imaging inspection apparatus with directional coolingENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·9 cites·11 claims
- 1185US7490984B2Method of making an imaging inspection apparatus with improved coolingENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Feb 17, 2009·8 cites·15 claims
- 1281US7186590B2Thermally enhanced lid for multichip modulesIBM·Filed 2003·Granted Mar 6, 2007·26 cites·20 claims
- 1378US6675852B2Platen for use in laminating pressIBM·Filed 2001·Granted Jan 13, 2004·14 cites·9 claims
- 1463US7253518B2Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 7, 2007·2 cites·13 claims
- 1539US2013025839A1Thermal substrateENDICOTT INTERCONNECT TECH INC·Filed 2011·Application pending·0 cites
- 1637US7183642B2Electronic package with thermally-enhanced lidIBM·Filed 2002·Granted Feb 27, 2007·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →