Inventor · disambiguated record
Ashwinkumar C. Bhatt
Also filed as: BHATT ASHWINKUMAR · BHATT ASHWINKUMAR C · BHATT ASHWINKUMAR CHINUPRASAD
29 granted patents·2 pending applications·841 citations·filing 1991–2011
97Inventor score
Top patents by PatentIndex Score
31 records- 0197US6608757B1Method for making a printed wiring boardIBM·Filed 2002·Granted Aug 19, 2003·120 cites·12 claims
- 0294US5268260APhotoresist develop and strip solvent compositions and method for their useIBM·Filed 1991·Granted Dec 7, 1993·102 cites·3 claims
- 0391US7261466B2Imaging inspection apparatus with directional coolingENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 28, 2007·16 cites·20 claims
- 0490US6162365APd etch mask for copper circuitizationIBM·Filed 1998·Granted Dec 19, 2000·80 cites·23 claims
- 0588US7354197B2Imaging inspection apparatus with improved coolingENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 8, 2008·10 cites·20 claims
- 0688US5798909ASingle-tiered organic chip carriers for wire bond-type chipsIBM·Filed 1995·Granted Aug 25, 1998·74 cites·5 claims
- 0787US7596863B2Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities thereinENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Oct 6, 2009·19 cites·10 claims
- 0885US7510324B2Method of inspecting articles using imaging inspection apparatus with directional coolingENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·9 cites·11 claims
- 0985US7490984B2Method of making an imaging inspection apparatus with improved coolingENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Feb 17, 2009·8 cites·15 claims
- 1083US5578796AApparatus for laminating and circuitizing substrates having openings thereinIBM·Filed 1995·Granted Nov 26, 1996·69 cites·10 claims
- 1181US6426565B1Electronic package and method of making sameIBM·Filed 2000·Granted Jul 30, 2002·36 cites·39 claims
- 1277US5724232AChip carrier having an organic photopatternable material and a metal substrateIBM·Filed 1996·Granted Mar 3, 1998·39 cites·6 claims
- 1376US6009620AMethod of making a printed circuit board having filled holesIBM·Filed 1998·Granted Jan 4, 2000·41 cites·34 claims
- 1472US5599747AMethod of making circuitized substrateIBM·Filed 1995·Granted Feb 4, 1997·31 cites·15 claims
- 1570US7801833B2Item identification control methodENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Sep 21, 2010·4 cites·10 claims
- 1670US6127097APhotoresist develop and strip solvent compositions and method for their useIBM·Filed 1997·Granted Oct 3, 2000·27 cites·5 claims
- 1768US5707893AMethod of making a circuitized substrate using two different metallization processesIBM·Filed 1995·Granted Jan 13, 1998·26 cites·15 claims
- 1866US5817405ACircuitized substrate with same surface conductors of different resolutionsIBM·Filed 1997·Granted Oct 6, 1998·25 cites·7 claims
- 1964US6038137AChip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereonIBM·Filed 1997·Granted Mar 14, 2000·21 cites·16 claims
- 2059US5566448AMethod of construction for multi-tiered cavities used in laminate carriersIBM·Filed 1995·Granted Oct 22, 1996·26 cites·10 claims
- 2159US5542175AMethod of laminating and circuitizing substrates having openings thereinIBM·Filed 1994·Granted Aug 6, 1996·25 cites·10 claims
- 2247US6740819B2Printed wiring boardIBM·Filed 2003·Granted May 25, 2004·1 cites·8 claims
- 2344US5922517AMethod of preparing a substrate surface for conformal platingIBM·Filed 1996·Granted Jul 13, 1999·9 cites·9 claims
- 2441US2004242270A1Electronic cardENDICOTT INTERCONNECT TECH INC·Filed 2003·Application pending·0 cites
- 2538US6887651B2Electrodeposited photoresist and dry film photoresist photolithography process for printed circuit board patterningIBM·Filed 2002·Granted May 3, 2005·1 cites·20 claims
- 2638US5827386AMethod for forming a multi-layered circuitized substrate memberIBM·Filed 1996·Granted Oct 27, 1998·9 cites·5 claims
- 2736US5905018AMethod of preparing a substrate surface for conformal platingIBM·Filed 1997·Granted May 18, 1999·3 cites·11 claims
- 2835US6093335AMethod of surface finishes for eliminating surface irregularities and defectsIBM·Filed 1997·Granted Jul 25, 2000·6 cites·8 claims
- 2935US2001041308A1Method of reducing defects in I/C card and resulting cardIBM·Filed 2001·Application pending·0 cites
- 3032US6274291B1Method of reducing defects in I/C card and resulting cardIBM·Filed 1998·Granted Aug 14, 2001·4 cites·10 claims
- 3128US8493173B2Method of cavity forming on a buried resistor layer using a fusion bonding processBHATT ASHWINKUMAR C·Filed 2011·Granted Jul 23, 2013·0 cites·16 claims
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