Inventor · disambiguated record
Jong-Keun Jeon
Also filed as: JEON JONG · JEON JONG-KEUN
11 granted patents·2 pending applications·82 citations·filing 2004–2013
88Inventor score
Top patents by PatentIndex Score
13 records- 0191US7420814B2Package stack and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 2, 2008·25 cites·18 claims
- 0286US7245138B2POGO pin and test socket including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 17, 2007·12 cites·26 claims
- 0384US7151368B2Insert block with pusher to push semiconductor device under testSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·14 cites·15 claims
- 0477US8619185B2Image sensor module having a wafer level chip size package and method of manufacting the same and imaging device including the image sensor module and method of manufacturing the image deviceYI DONG-HUN·Filed 2010·Granted Dec 31, 2013·6 cites·11 claims
- 0571US7939917B2Tape structures, and methods and apparatuses for separating a wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 10, 2011·3 cites·24 claims
- 0670US7427558B2Method of forming solder ball, and fabricating method and structure of semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 23, 2008·4 cites·20 claims
- 0766US7235887B2Semiconductor package with improved chip attachment and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 26, 2007·16 cites·25 claims
- 0862US7452753B2Method of processing a semiconductor wafer for manufacture of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 18, 2008·2 cites·10 claims
- 0955US9554024B2Method of manufacturing an image sensor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 24, 2017·0 cites·10 claims
- 1047US8019212B2Optical module for a photographing apparatus and photographing apparatus having the sameSAMSUNG TECHWIN CO LTD·Filed 2007·Granted Sep 13, 2011·0 cites·22 claims
- 1144US2008251949A1Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1240US8115323B2Semiconductor package and method of manufacturing the semiconductor packageSIN WHA-SU·Filed 2008·Granted Feb 14, 2012·0 cites·18 claims
- 1329US2006003491A1Apparatus for ejecting relatively thin IC chip from semiconductor waferKIM GOON-WOO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →