Inventor · disambiguated record
Lior Shiv
Also filed as: SHIV LIOR
16 granted patents·4 pending applications·232 citations·filing 1999–2018
93Inventor score
Top patents by PatentIndex Score
20 records- 0195US7531445B2Formation of through-wafer electrical interconnections and other structures using a thin dielectric membraneHYMITE AS·Filed 2007·Granted May 12, 2009·35 cites·10 claims
- 0293US7662710B2Formation of through-wafer electrical interconnections and other structures using a thin dielectric membraneHYMITE AS·Filed 2009·Granted Feb 16, 2010·26 cites·11 claims
- 0393US7211929B2Multilayer piezoelectric motorNANOMOTION LTD·Filed 2006·Granted May 1, 2007·28 cites·11 claims
- 0492US6979936B1Piezoelectric motors and motor driving configurationsNANOMOTION LTD·Filed 2000·Granted Dec 27, 2005·46 cites·51 claims
- 0580US7075211B1Multilayer piezoelectric motorNANOMOTION LTD·Filed 1999·Granted Jul 11, 2006·33 cites·44 claims
- 0679US7199507B2Piezoelectric motors and motor driving configurationsNANOMOTION LTD·Filed 2005·Granted Apr 3, 2007·14 cites·23 claims
- 0775US7553695B2Method of fabricating a package for a micro componentHYMITE AS·Filed 2005·Granted Jun 30, 2009·8 cites·16 claims
- 0875US7183690B2Resonance shiftingNANOMOTION LTD·Filed 2005·Granted Feb 27, 2007·7 cites·17 claims
- 0969US6879085B1Resonance shiftingNANOMOTION LTD·Filed 2000·Granted Apr 12, 2005·19 cites·41 claims
- 1063US7732234B2Fabrication process for package with light emitting device on a sub-mountHYMITE AS·Filed 2007·Granted Jun 8, 2010·3 cites·36 claims
- 1160US7470622B2Fabrication and use of polished silicon micro-mirrorsHYMITE AS·Filed 2005·Granted Dec 30, 2008·2 cites·18 claims
- 1255US7732240B2Formation of through-wafer electrical interconnections and other structures using a thin dielectric membraneHYMITE AS·Filed 2009·Granted Jun 8, 2010·0 cites·7 claims
- 1351US6661153B1Method and apparatus for driving piezoelectric motorsNANOMOTION LTD·Filed 1999·Granted Dec 9, 2003·11 cites·17 claims
- 1445US11215638B2Probe for testing an electrical property of a test sampleCAPRES AS·Filed 2018·Granted Jan 4, 2022·0 cites·14 claims
- 1543US8729591B2Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contactsKUHMANN JOCHEN·Filed 2009·Granted May 20, 2014·0 cites·20 claims
- 1643US2007120041A1Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the SameSHIV LIOR·Filed 2006·Application pending·0 cites
- 1742US9983231B2Deep-etched multipoint probeCAPRES AS·Filed 2013·Granted May 29, 2018·0 cites·9 claims
- 1842US2010176507A1Semiconductor-based submount with electrically conductive feed-throughsHYMITE AS·Filed 2009·Application pending·0 cites
- 1939US2008164606A1Spacers for wafer bondingGREISEN CHRISTOFFER GRAAE·Filed 2007·Application pending·0 cites
- 2037US2005269688A1Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed packageSHIV LIOR·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →