Inventor · disambiguated record
Bo Soon Chang
Also filed as: CHANG BO · CHANG BO S · CHANG BO SOON
27 granted patents·356 citations·filing 1998–2023
97Inventor score
Top patents by PatentIndex Score
27 records- 0192US7818085B1System for controlling the processing of an integrated circuit chip assembly lineCYPRESS SEMICONDUCTOR CORP·Filed 2005·Granted Oct 19, 2010·19 cites·23 claims
- 0290US7939372B1Semiconductor device packaging using etched leadfingersCYPRESS SEMICONDUCTOR CORP·Filed 2007·Granted May 10, 2011·20 cites·10 claims
- 0386US8436460B1Multiple die paddle leadframe and semiconductor device packageGAMBOA CARLO·Filed 2007·Granted May 7, 2013·27 cites·15 claims
- 0483US7031791B1Method and system for a reject management protocol within a back-end integrated circuit manufacturing processCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Apr 18, 2006·27 cites·29 claims
- 0582US8017445B1Warpage-compensating die paddle design for high thermal-mismatched package constructionCYPRESS SEMICONDUCTOR CORP·Filed 2007·Granted Sep 13, 2011·17 cites·20 claims
- 0682US6562272B1Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packagesCYPRESS SEMICONDUCTOR CORP·Filed 2000·Granted May 13, 2003·24 cites·20 claims
- 0780US7698015B1Integrated back-end integrated circuit manufacturing assemblyCYPRESS SEMICONDUCTOR CORP·Filed 2005·Granted Apr 13, 2010·6 cites·16 claims
- 0879US6215689B1Architecture, circuitry and method for configuring volatile and/or non-volatile memory for programmable logic applicationsCYPRESS SEMICONDUCTOR CORP·Filed 1999·Granted Apr 10, 2001·42 cites·22 claims
- 0978US7939371B1Flip-flop semiconductor device packaging using an interposerCYPRESS SEMICONDUCTOR CORP·Filed 2007·Granted May 10, 2011·8 cites·11 claims
- 1078US7105377B1Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing processCYPRESS SEMICONDUCTOR CORP·Filed 2004·Granted Sep 12, 2006·21 cites·13 claims
- 1177US7391104B1Non-stick detection method and mechanism for array molded laminate packagesCYPRESS SEMICONDUCTOR CORP·Filed 2005·Granted Jun 24, 2008·9 cites·29 claims
- 1276US9263398B1Semiconductor packaging identifierCYPRESS SEMICONDUCTOR CORP·Filed 2015·Granted Feb 16, 2016·2 cites·20 claims
- 1373US6931298B1Integrated back-end integrated circuit manufacturing assemblyCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Aug 16, 2005·13 cites·52 claims
- 1473US6730545B1Method of performing back-end manufacturing of an integrated circuit deviceCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted May 4, 2004·13 cites·42 claims
- 1571US6649447B1Methods for plastic injection molding, with particular applicability in facilitating use of high density lead framesCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Nov 18, 2003·15 cites·19 claims
- 1670US8999752B1Semiconductor packaging identifierCHANG BO SOON·Filed 2008·Granted Apr 7, 2015·5 cites·20 claims
- 1767US12190626B2Fingerprint sensor packagesCYPRESS SEMICONDUCTOR CORP·Filed 2023·Granted Jan 7, 2025·0 cites·18 claims
- 1866US7045387B1Method of performing back-end manufacturing of an integrated circuit deviceCYPRESS SEMICONDUCTOR CORP·Filed 2004·Granted May 16, 2006·8 cites·25 claims
- 1965US6901984B1Method and system for controlling the processing of an integrated circuit chip assembly line using a central computer system and a common communication protocolCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Jun 7, 2005·8 cites·23 claims
- 2064US6853202B1Non-stick detection method and mechanism for array molded laminate packagesCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Feb 8, 2005·13 cites·11 claims
- 2162US7608914B1Integrated circuit package with electrically isolated leadsCYPRESS SEMICONDUCTOR CORP·Filed 2006·Granted Oct 27, 2009·2 cites·11 claims
- 2258US6331728B1High reliability lead frame and packaging technology containing the sameCYPRESS SEMICONDUCTOR CORP·Filed 1999·Granted Dec 18, 2001·22 cites·13 claims
- 2356US6730532B1Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing processCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted May 4, 2004·5 cites·16 claims
- 2455US6316821B1High density lead frames and methods for plastic injection moldingCYPRESS SEMICONDUCTOR CORP·Filed 1998·Granted Nov 13, 2001·18 cites·12 claims
- 2552US6576491B1Methods for producing high reliability lead frame and packaging semiconductor die using such lead frameCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Jun 10, 2003·5 cites·30 claims
- 2644US8318547B1Integrated circuit package with electrically isolated leadsSPURLOCK BRETT ALAN·Filed 2009·Granted Nov 27, 2012·0 cites·17 claims
- 2736US6169322B1Die attach pad adapted to reduce delamination stress and method of using sameCYPRESS SEMICONDUCTOR CORP·Filed 1998·Granted Jan 2, 2001·7 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →