Inventor · disambiguated record
Luguang Wang
Also filed as: WANG LUGUANG
20 granted patents·1 pending application·1 citations·filing 2019–2023
87Inventor score
Files withCHANGXIN MEMORY TECH INC18BEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO LTD1Baidu online network technology beijing co ltd1UNIV OREGON STATE1
Top patents by PatentIndex Score
21 records- 0184US12387779B2Word-line drive circuit, word-line driver and storage deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Aug 12, 2025·1 cites·15 claims
- 0269US2024140987A1Microbial electrosynthesis of single cell proteinUNIV OREGON STATE·Filed 2023·Application pending·0 cites
- 0366US12315795B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2023·Granted May 27, 2025·0 cites·7 claims
- 0463US12289882B2Semiconductor device including air gap structure above word lineCHANGXIN MEMORY TECH INC·Filed 2022·Granted Apr 29, 2025·0 cites·18 claims
- 0561US12424542B2Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 0660US12495540B2Semiconductor structure and method for fabricating sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 9, 2025·0 cites·14 claims
- 0759US12211767B2Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 28, 2025·0 cites·16 claims
- 0858US12040296B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 16, 2024·0 cites·18 claims
- 0957US12119283B2Heat dissipation structure, method for forming heat dissipation structure, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 15, 2024·0 cites·16 claims
- 1056US11995606B2Method for determine distribution positions of commodities and apparatus, electronic device, and storage mediumBEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO LTD·Filed 2019·Granted May 28, 2024·0 cites·10 claims
- 1155US12417984B2Semiconductor structure with an air gap, method for forming same, and stacked structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 16, 2025·0 cites·18 claims
- 1255US12218033B2Semiconductor structure, method for forming same and stacked structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 4, 2025·0 cites·17 claims
- 1354US12394739B2Semiconductor package and method of manufacturing semiconductor packageCHANGXIN MEMORY TECH INC·Filed 2022·Granted Aug 19, 2025·0 cites·18 claims
- 1454US12230553B2Semiconductor structure, manufacturing method of semiconductor structure and stacked structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 18, 2025·0 cites·14 claims
- 1554US12131979B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 29, 2024·0 cites·14 claims
- 1653US12136568B2Semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Nov 5, 2024·0 cites·18 claims
- 1753US12046478B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 23, 2024·0 cites·16 claims
- 1852US12100680B2Semiconductor structure and method for preparing sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 24, 2024·0 cites·17 claims
- 1951US11990426B2Semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 21, 2024·0 cites·16 claims
- 2045US12283347B2Word line driver and memory deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 2133US11252245B2Information pushing method and deviceBaidu online network technology beijing co ltd·Filed 2019·Granted Feb 15, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →