Inventor · disambiguated record
Mohammed Rabiul Islam
Also filed as: ISLAM MOHAMMED R · ISLAM MOHAMMED RABIUL
18 granted patents·6 pending applications·398 citations·filing 1999–2025
93Inventor score
Top patents by PatentIndex Score
24 records- 0197US11215753B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 4, 2022·4 cites·20 claims
- 0293US11808977B2Structures and methods for high speed interconnection in photonic systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·1 cites·20 claims
- 0392US6444569B2Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) processMOTOROLA INC·Filed 2001·Granted Sep 3, 2002·60 cites·29 claims
- 0489US6326301B1Method for forming a dual inlaid copper interconnect structureMOTOROLA INC·Filed 1999·Granted Dec 4, 2001·83 cites·16 claims
- 0589US6297155B1Method for forming a copper layer over a semiconductor waferMOTOROLA INC·Filed 1999·Granted Oct 2, 2001·132 cites·42 claims
- 0685US6274478B1Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) processMOTOROLA INC·Filed 1999·Granted Aug 14, 2001·70 cites·9 claims
- 0783US2024369761A1Photonic Semiconductor Device And MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0882US6551919B2Method for forming a dual inlaid copper interconnect structureMOTOROLA INC·Filed 2001·Granted Apr 22, 2003·23 cites·6 claims
- 0981US12092862B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1080US12265258B2Structures and methods for high speed interconnection in photonic systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 1179US11966090B2Heterogeneous packaging integration of photonic and electronic elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·1 cites·20 claims
- 1279US6573173B2Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) processMOTOROLA INC·Filed 2002·Granted Jun 3, 2003·23 cites·3 claims
- 1379US2025110303A1Apparatus and methods for optical interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1478US2025199240A1Structures and methods for high speed interconnection in photonic systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1577US12223247B2Logic cell structures and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 1676US11703639B2Photonic semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 18, 2023·0 cites·20 claims
- 1775US2024347513A1Three-dimensional integrated circuit (3d ic) low-dropout (ldo) regulator power deliveryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1871US11550102B2Structures and methods for high speed interconnection in photonic systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 1970US12046580B2Three-dimensional integrated circuit (3D IC) low-dropout (LDO) regulator power deliveryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 2069US2025148183A1Logic cell structures and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2168US2024241329A1Heterogeneous packaging integration of photonic and electronic elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2267US11816412B2Logic cell structures and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 2366US12181724B2Apparatus and methods for optical interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 2459US7894517B2Self-calibrated adaptive equalization system and methods of performing the sameTEXAS INSTRUMENTS INC·Filed 2007·Granted Feb 22, 2011·1 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →