Inventor · disambiguated record

Sungmin Yim

Also filed as: YIM SUNGMIN

7 granted patents·30 citations·filing 2015–2022

83Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD7

Top patents by PatentIndex Score

7 records

0196US11837273B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 5, 2023·2 cites·20 claims
0296US9805769B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 31, 2017·19 cites·7 claims
0393US10971208B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 6, 2021·3 cites·19 claims
0492US10734059B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 4, 2020·5 cites·20 claims
0575US10418087B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 17, 2019·1 cites·23 claims
0674US11417386B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 16, 2022·0 cites·20 claims
0764US11328760B2Semiconductor device having interconnection in package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 10, 2022·0 cites·21 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →