Inventor · disambiguated record
Xiaoyi Ding
Also filed as: DING XIAOYI
18 granted patents·429 citations·filing 1998–2017
94Inventor score
Files withContinental automotive systems inc5DING XIAOYI5MOTOROLA INC4CONTINENTAL AUTOMOTIVE SYSTEMS2TEMIC AUTOMOTIVE NA INC2
Top patents by PatentIndex Score
18 records- 0194US8215176B2Pressure sensor for harsh media sensing and flexible packagingDING XIAOYI·Filed 2009·Granted Jul 10, 2012·45 cites·23 claims
- 0294US6929974B2Feedthrough design and method for a hermetically sealed microdeviceMOTOROLA INC·Filed 2003·Granted Aug 16, 2005·123 cites·36 claims
- 0394US6806557B2Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuumMOTOROLA INC·Filed 2002·Granted Oct 19, 2004·107 cites·15 claims
- 0491US7045868B2Wafer-level sealed microdevice having trench isolation and methods for making the sameMOTOROLA INC·Filed 2003·Granted May 16, 2006·58 cites·20 claims
- 0585US7204737B2Hermetically sealed microdevice with getter shieldTEMIC AUTOMOTIVE NA INC·Filed 2004·Granted Apr 17, 2007·65 cites·14 claims
- 0682US9676618B2Embedded structures for high glass strength and robust packagingContinental automotive systems inc·Filed 2015·Granted Jun 13, 2017·2 cites·7 claims
- 0782US7378294B2Wafer-level sealed microdevice having trench isolation and methods for making the sameTEMIC AUTOMOTIVE NA INC·Filed 2005·Granted May 27, 2008·9 cites·18 claims
- 0870US8618675B2Thin semiconductor die packageDING XIAOYI·Filed 2011·Granted Dec 31, 2013·4 cites·18 claims
- 0969US8164153B2Thin semiconductor device having embedded die support and methods of making the sameDING XIAOYI·Filed 2009·Granted Apr 24, 2012·2 cites·14 claims
- 1068US9574961B2Humidity resistant sensors and methods of making sameContinental automotive systems inc·Filed 2015·Granted Feb 21, 2017·1 cites·5 claims
- 1167US9546922B2Absolute pressure sensor with improved cap bonding boundaryContinental automotive systems inc·Filed 2014·Granted Jan 17, 2017·3 cites·12 claims
- 1266US8791540B2Thin semiconductor device having embedded die support and methods of making the sameDING XIAOYI·Filed 2012·Granted Jul 29, 2014·1 cites·35 claims
- 1365US8878316B2Cap side bonding structure for backside absolute pressure sensorsCONTINENTAL AUTOMOTIVE SYSTEMS·Filed 2013·Granted Nov 4, 2014·1 cites·18 claims
- 1465US8791539B2Thin semiconductor device having embedded die support and methods of making the sameDING XIAOYI·Filed 2012·Granted Jul 29, 2014·1 cites·33 claims
- 1556US10189707B2Embedded structures for high glass strength and robust packagingContinental automotive systems inc·Filed 2017·Granted Jan 29, 2019·0 cites·15 claims
- 1647US10352806B2Humidity resistant sensors and methods of making sameContinental automotive systems inc·Filed 2017·Granted Jul 16, 2019·0 cites·11 claims
- 1745US9395259B2Piezoresistive transducer with low thermal noiseCONTINENTAL AUTOMOTIVE SYSTEMS·Filed 2013·Granted Jul 19, 2016·0 cites·21 claims
- 1837US6142021ASelectable pressure sensorMOTOROLA INC·Filed 1998·Granted Nov 7, 2000·7 cites·11 claims
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