Assignee
DING XIAOYI
US·5 granted patents·53 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0194US8215176B2Pressure sensor for harsh media sensing and flexible packagingDING XIAOYI·Filed 2009·Granted Jul 10, 2012·45 cites·23 claims
- 0270US8618675B2Thin semiconductor die packageDING XIAOYI·Filed 2011·Granted Dec 31, 2013·4 cites·18 claims
- 0369US8164153B2Thin semiconductor device having embedded die support and methods of making the sameDING XIAOYI·Filed 2009·Granted Apr 24, 2012·2 cites·14 claims
- 0466US8791540B2Thin semiconductor device having embedded die support and methods of making the sameDING XIAOYI·Filed 2012·Granted Jul 29, 2014·1 cites·35 claims
- 0565US8791539B2Thin semiconductor device having embedded die support and methods of making the sameDING XIAOYI·Filed 2012·Granted Jul 29, 2014·1 cites·33 claims
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