Inventor · disambiguated record
John Harold Magerlein
Also filed as: MAGERLEIN JOHN H · MAGERLEIN JOHN HAROLD
33 granted patents·2 pending applications·939 citations·filing 1997–2012
98Inventor score
Top patents by PatentIndex Score
35 records- 0199US7990711B1Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plateIBM·Filed 2010·Granted Aug 2, 2011·142 cites·25 claims
- 0298US7808781B2Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirementsIBM·Filed 2008·Granted Oct 5, 2010·47 cites·14 claims
- 0397US8110415B2Silicon based microchannel cooling and electrical packageKNICKERBOCKER JOHN ULRICH·Filed 2008·Granted Feb 7, 2012·38 cites·10 claims
- 0497US7928562B2Segmentation of a die stack for 3D packaging thermal managementIBM·Filed 2008·Granted Apr 19, 2011·58 cites·18 claims
- 0595US7190580B2Apparatus and methods for microchannel cooling of semiconductor integrated circuit packagesIBM·Filed 2004·Granted Mar 13, 2007·103 cites·29 claims
- 0693US8115303B2Semiconductor package structures having liquid coolers integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2008·Granted Feb 14, 2012·28 cites·11 claims
- 0793US7139172B2Apparatus and methods for microchannel cooling of semiconductor integrated circuit packagesIBM·Filed 2004·Granted Nov 21, 2006·83 cites·18 claims
- 0893US6593644B2System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing faceIBM·Filed 2001·Granted Jul 15, 2003·85 cites·15 claims
- 0992US8581392B2Silicon based microchannel cooling and electrical packageIBM·Filed 2012·Granted Nov 12, 2013·8 cites·17 claims
- 1092US7808798B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2008·Granted Oct 5, 2010·27 cites·14 claims
- 1192US7518229B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2006·Granted Apr 14, 2009·31 cites·3 claims
- 1292US7202764B2Noble metal contacts for micro-electromechanical switchesIBM·Filed 2003·Granted Apr 10, 2007·39 cites·13 claims
- 1391US8772927B2Semiconductor package structures having liquid cooler integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2011·Granted Jul 8, 2014·12 cites·10 claims
- 1488US7638406B2Method of fabricating a high Q factor integrated circuit inductorIBM·Filed 2005·Granted Dec 29, 2009·13 cites·16 claims
- 1588US7473102B2Space transforming land grid array interposersIBM·Filed 2006·Granted Jan 6, 2009·16 cites·14 claims
- 1687US6774482B2Chip coolingIBM·Filed 2002·Granted Aug 10, 2004·44 cites·27 claims
- 1785US7855442B2Silicon based packageIBM·Filed 2007·Granted Dec 21, 2010·10 cites·7 claims
- 1885US6819000B2High density area array solder microjoining interconnect structure and fabrication methodIBM·Filed 2003·Granted Nov 16, 2004·28 cites·4 claims
- 1984US8421220B2Silicon based microchannel cooling and electrical packageKNICKERBOCKER JOHN ULRICH·Filed 2012·Granted Apr 16, 2013·4 cites·14 claims
- 2081US8505617B2Structure and apparatus for cooling integrated circuits using copper microchannelsBEZAMA RASCHID JOSE·Filed 2012·Granted Aug 13, 2013·3 cites·6 claims
- 2179US7189595B2Method of manufacture of silicon based package and devices manufactured therebyIBM·Filed 2004·Granted Mar 13, 2007·21 cites·9 claims
- 2278US8210243B2Structure and apparatus for cooling integrated circuits using cooper microchannelsBEZAMA RASCHID JOSE·Filed 2008·Granted Jul 3, 2012·4 cites·13 claims
- 2378US6661098B2High density area array solder microjoining interconnect structure and fabrication methodIBM·Filed 2002·Granted Dec 9, 2003·18 cites·16 claims
- 2476US8097492B2Method and manufacture of silicon based package and devices manufactured therebyMAGERLEIN JOHN H·Filed 2008·Granted Jan 17, 2012·7 cites·10 claims
- 2575US7829427B2Method of fabricating a high Q factor integrated circuit inductorIBM·Filed 2009·Granted Nov 9, 2010·4 cites·16 claims
- 2673US6732908B2High density raised stud microjoining system and methods of fabricating the sameIBM·Filed 2002·Granted May 11, 2004·19 cites·15 claims
- 2771US8418751B2Stacked and redundant chip coolersBEZAMA RASCHID JOSE·Filed 2008·Granted Apr 16, 2013·5 cites·7 claims
- 2871US7581314B2Method of forming noble metal contactsIBM·Filed 2006·Granted Sep 1, 2009·5 cites·7 claims
- 2971US7068138B2High Q factor integrated circuit inductorIBM·Filed 2004·Granted Jun 27, 2006·12 cites·30 claims
- 3061US6747472B2Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the sameIBM·Filed 2002·Granted Jun 8, 2004·8 cites·22 claims
- 3152US7128472B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2003·Granted Oct 31, 2006·3 cites·15 claims
- 3247US6657291B1Combined resistor-capacitor elements for decoupling in electronic packagesIBM·Filed 1997·Granted Dec 2, 2003·14 cites·5 claims
- 3346US2009302454A1Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate waferCHENG YU-TING·Filed 2009·Application pending·0 cites
- 3440US7880305B2Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate waferIBM·Filed 2002·Granted Feb 1, 2011·0 cites·2 claims
- 3538US2005127500A1Local reduction of compliant thermally conductive material layer thickness on chipsIBM·Filed 2003·Application pending·0 cites
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