Inventor · disambiguated record
Peter Howard Spalding
Also filed as: SPALDING PETER · SPALDING PETER H · SPALDING PETER HOWARD
20 granted patents·905 citations·filing 1995–2004
96Inventor score
Files withNAT SEMICONDUCTOR CORP20
Top patents by PatentIndex Score
20 records- 0199US6348726B1Multi row leadless leadframe packageNAT SEMICONDUCTOR CORP·Filed 2001·Granted Feb 19, 2002·264 cites·12 claims
- 0294US6399415B1Electrical isolation in panels of leadless IC packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 4, 2002·145 cites·10 claims
- 0392US6452255B1Low inductance leadless packageNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 17, 2002·103 cites·11 claims
- 0491US6372539B1Leadless packaging process using a conductive substrateNAT SEMICONDUCTOR CORP·Filed 2000·Granted Apr 16, 2002·71 cites·14 claims
- 0584US6674156B1Multiple row fine pitch leadless leadframe package with use of half-etch processNAT SEMICONDUCTOR CORP·Filed 2001·Granted Jan 6, 2004·39 cites·21 claims
- 0683US6448107B1Pin indicator for leadless leadframe packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·39 cites·16 claims
- 0778US6686652B1Locking lead tips and die attach pad for a leadless package apparatus and methodNAT SEMICONDUCTOR CORP·Filed 2000·Granted Feb 3, 2004·31 cites·29 claims
- 0875US6617197B1Multi row leadless leadframe packageNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 9, 2003·19 cites·10 claims
- 0975US6483180B1Lead frame design for burr-free singulation of molded array packagesNAT SEMICONDUCTOR CORP·Filed 1999·Granted Nov 19, 2002·48 cites·9 claims
- 1067US6551048B1Off-load system for semiconductor devicesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Apr 22, 2003·11 cites·34 claims
- 1166US5926695ALead frame incorporating material flow divertersNAT SEMICONDUCTOR CORP·Filed 1997·Granted Jul 20, 1999·38 cites·17 claims
- 1265US5629563AComponent stacking in multi-chip semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 1995·Granted May 13, 1997·41 cites·20 claims
- 1364US6677667B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jan 13, 2004·11 cites·34 claims
- 1462US6576989B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 10, 2003·10 cites·21 claims
- 1561US5789806ALeadframe including bendable support arms for downsetting a die attach padNAT SEMICONDUCTOR CORP·Filed 1997·Granted Aug 4, 1998·34 cites·10 claims
- 1644US6808961B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Oct 26, 2004·1 cites·24 claims
- 1740US6818970B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 16, 2004·0 cites·22 claims
- 1838US6963124B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2004·Granted Nov 8, 2005·0 cites·22 claims
- 1938US6933174B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·0 cites·27 claims
- 2025US5986332AIntegrated circuit leadframe incorporating overhanging leadsNAT SEMICONDUCTOR CORP·Filed 1998·Granted Nov 16, 1999·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Peter Howard Spalding files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →