Inventor · disambiguated record
Tadayoshi Watanabe
Also filed as: WATANABE TADAYOSHI
12 granted patents·4 pending applications·91 citations·filing 2000–2022
89Inventor score
Top patents by PatentIndex Score
16 records- 0186US8044519B2Semiconductor device and method of fabricating the sameTOSHIBA KK·Filed 2008·Granted Oct 25, 2011·14 cites·11 claims
- 0281US7888253B2Method of fabricating semiconductor deviceTOSHIBA KK·Filed 2007·Granted Feb 15, 2011·9 cites·8 claims
- 0379US6407453B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2000·Granted Jun 18, 2002·32 cites·14 claims
- 0478US9082866B2Semiconductor storage device and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted Jul 14, 2015·5 cites·12 claims
- 0574US7944053B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2008·Granted May 17, 2011·5 cites·17 claims
- 0672US7902068B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2007·Granted Mar 8, 2011·5 cites·21 claims
- 0769US7755202B2Semiconductor device and method of fabricating the sameTOSHIBA KK·Filed 2008·Granted Jul 13, 2010·4 cites·14 claims
- 0866US7847405B2Semiconductor device and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2009·Granted Dec 7, 2010·3 cites·8 claims
- 0958US7888262B2Semiconductor device and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2007·Granted Feb 15, 2011·1 cites·11 claims
- 1056US12170247B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted Dec 17, 2024·0 cites·20 claims
- 1156US6787462B2Method of manufacturing semiconductor device having buried metal wiringTOSHIBA KK·Filed 2002·Granted Sep 7, 2004·13 cites·17 claims
- 1245US2011097890A1Method of fabricating semiconductor deviceTOSHIBA KK·Filed 2011·Application pending·0 cites
- 1339US2011189850A1Semiconductor device and method of manufacturing the sameUSUI TAKAMASA·Filed 2011·Application pending·0 cites
- 1439US2014054754A1Optically reactive maskingWATANABE TADAYOSHI·Filed 2012·Application pending·0 cites
- 1538US2011108987A1Semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 1633US8614510B2Semiconductor device including a metal wiring with a metal capTOMIZAWA HIDEYUKI·Filed 2010·Granted Dec 24, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →