Inventor · disambiguated record
Brett Dunlap
Also filed as: DUNLAP BRETT · DUNLAP BRETT ARNOLD
22 granted patents·3 pending applications·263 citations·filing 2009–2023
95Inventor score
Files withSYNAPTICS INC8AMKOR TECHNOLOGY INC7DUNLAP BRETT ARNOLD3KUO BOB SHIH-WEI2AMKOR TECH SINGAPORE HOLDING PTE LTD1
Top patents by PatentIndex Score
25 records- 0197US8432022B1Shielded embedded electronic component substrate fabrication method and structureHUEMOELLER RONALD PATRICK·Filed 2009·Granted Apr 30, 2013·65 cites·16 claims
- 0296US8653674B1Electronic component package fabrication method and structureDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Feb 18, 2014·28 cites·20 claims
- 0396US8535961B1Light emitting diode (LED) package and methodKUO BOB SHIH-WEI·Filed 2010·Granted Sep 17, 2013·41 cites·19 claims
- 0495US9651513B2Fingerprint sensor and button combinations and methods of making sameSYNAPTICS INC·Filed 2013·Granted May 16, 2017·15 cites·19 claims
- 0594US8937381B1Thin stackable package and methodDUNLAP BRETT ARNOLD·Filed 2009·Granted Jan 20, 2015·58 cites·18 claims
- 0692US9013011B1Stacked and staggered die MEMS package and methodKUO BOB SHIH-WEI·Filed 2011·Granted Apr 21, 2015·18 cites·21 claims
- 0791US8791501B1Integrated passive device structure and methodFUENTES RUBEN·Filed 2010·Granted Jul 29, 2014·20 cites·16 claims
- 0884US10055631B1Semiconductor package for sensor applicationsSYNAPTICS INC·Filed 2016·Granted Aug 21, 2018·6 cites·17 claims
- 0983US8337657B1Mechanical tape separation package and methodDUNLAP BRETT ARNOLD·Filed 2010·Granted Dec 25, 2012·6 cites·19 claims
- 1080US8753730B1Mechanical tape separation packageAMKOR TECHNOLOGY INC·Filed 2012·Granted Jun 17, 2014·4 cites·20 claims
- 1174US11829565B2Fingerprint sensor and button combinations and methods of making sameSYNAPTICS INC·Filed 2021·Granted Nov 28, 2023·0 cites·14 claims
- 1272US11545405B2Packaging for fingerprint sensors and methods of manufactureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 1364US8941250B1Electronic component package fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2014·Granted Jan 27, 2015·1 cites·20 claims
- 1463US12429988B2Fingerprint sensor and button combinations and methods of making sameSYNAPTICS INC·Filed 2023·Granted Sep 30, 2025·0 cites·16 claims
- 1563US11119615B2Fingerprint sensor and button combinations and methods of making sameSYNAPTICS INC·Filed 2019·Granted Sep 14, 2021·0 cites·4 claims
- 1663US9691734B1Method of forming a plurality of electronic component packagesDUNLAP BRETT ARNOLD·Filed 2009·Granted Jun 27, 2017·1 cites·20 claims
- 1762US2020335476A1Method of forming a plurality of electronic component packages and packages formed therebyAMKOR TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 1859US10636717B2Packaging for fingerprint sensors and methods of manufactureAMKOR TECHNOLOGY INC·Filed 2017·Granted Apr 28, 2020·0 cites·9 claims
- 1958USRE47890EPackaging for fingerprint sensors and methods of manufactureAMKOR TECHNOLOGY INC·Filed 2017·Granted Mar 3, 2020·0 cites·13 claims
- 2058US10546833B2Method of forming a plurality of electronic component packagesAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 28, 2020·0 cites·20 claims
- 2157US10325132B2Fingerprint sensor and button combinations and methods of making sameSYNAPTICS INC·Filed 2017·Granted Jun 18, 2019·0 cites·17 claims
- 2256US9754852B2Packaging for fingerprint sensors and methods of manufactureAMKOR TECHNOLOGY INC·Filed 2016·Granted Sep 5, 2017·0 cites·12 claims
- 2344US10338754B2Edge-effect mitigation for capacitive sensorsSYNAPTICS INC·Filed 2016·Granted Jul 2, 2019·0 cites·18 claims
- 2442US2014162407A1Method And System For Semiconductor PackagingZWENGER CURTIS MICHAEL·Filed 2012·Application pending·0 cites
- 2538US2015187707A1Biometric Image Sensor Packaging and MountingSYNAPTICS INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →