Inventor · disambiguated record
Vincent Mevellec
Also filed as: MEVELLEC VINCENT
14 granted patents·3 pending applications·22 citations·filing 2007–2023
87Inventor score
Top patents by PatentIndex Score
17 records- 0177US8883641B2Solution and method for activating the oxidized surface of a semiconductor substrateMEVELLEC VINCENT·Filed 2010·Granted Nov 11, 2014·5 cites·10 claims
- 0273US9190283B2Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said methodMEVELLEC VINCENT·Filed 2012·Granted Nov 17, 2015·1 cites·20 claims
- 0372US8119542B2Method of preparing an electrically insulating film and application for the metallization of viasMEVELLEC VINCENT·Filed 2009·Granted Feb 21, 2012·4 cites·24 claims
- 0470US8709542B2Method for preparing an organic film at the surface of solid support under non-electrochemical conditions, solid support thus obtained and preparation kitMEVELLEC VINCENT·Filed 2007·Granted Apr 29, 2014·1 cites·49 claims
- 0566US9368397B2Method for forming a vertical electrical connection in a layered semiconductor structureSUHR DOMINIQUE·Filed 2012·Granted Jun 14, 2016·3 cites·21 claims
- 0663US9725602B2Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kitMEVELLEC VINCENT·Filed 2007·Granted Aug 8, 2017·3 cites·72 claims
- 0760US9790370B2Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kitMEVELLEC VINCENT·Filed 2007·Granted Oct 17, 2017·3 cites·33 claims
- 0860US8524512B2Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this methodMEVELLEC VINCENT·Filed 2009·Granted Sep 3, 2013·1 cites·31 claims
- 0954US10472726B2Electrolyte and process for electroplating copper onto a barrier layerALCHIMER·Filed 2013·Granted Nov 12, 2019·0 cites·25 claims
- 1054US2025137140A1Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor devicesMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 1152US10883185B2Copper electrodeposition solution and process for high aspect ratio patternsAVENI·Filed 2017·Granted Jan 5, 2021·1 cites·11 claims
- 1245US2023335496A1Process for Fabricating a 3D-NAND Flash MemoryMACDERMID ENTHONE INC·Filed 2021·Application pending·0 cites
- 1344US9790371B2Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kitMEVELLEC VINCENT·Filed 2007·Granted Oct 17, 2017·0 cites·29 claims
- 1444US9564333B2Method for forming a metal silicide using a solution containing gold ions and fluorine ionsALCHIMER·Filed 2014·Granted Feb 7, 2017·0 cites·19 claims
- 1539US11384445B2Process for electrodeposition of cobaltAVENI·Filed 2019·Granted Jul 12, 2022·0 cites·14 claims
- 1635US9181623B2Solution and process for activating the surface of a semiconductor substrateMEVELLEC VINCENT·Filed 2010·Granted Nov 10, 2015·0 cites·21 claims
- 1732US2022090283A1Electrodeposition of a cobalt or copper alloy, and use in microelectronicsAVENI·Filed 2020·Application pending·0 cites
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