Inventor · disambiguated record
Yin-Po Hung
Also filed as: HUNG YIN-PO
4 granted patents·1 pending application·10 citations·filing 2011–2017
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0179US9859159B2Interconnection structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Jan 2, 2018·3 cites·3 claims
- 0276US9142473B2Stacked type power device moduleIND TECH RES INST·Filed 2013·Granted Sep 22, 2015·5 cites·11 claims
- 0375US10141224B2Manufacturing method of interconnection structureUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 27, 2018·2 cites·6 claims
- 0437US2013043599A1Chip package process and chip package structureIND TECH RES INST·Filed 2012·Application pending·0 cites
- 0532US8502378B2Package unit and stacking structure thereofHUNG YIN-PO·Filed 2011·Granted Aug 6, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →