Inventor · disambiguated record
Chang Gun Oh
Also filed as: OH CHANG GUN
12 granted patents·14 pending applications·31 citations·filing 1998–2022
86Inventor score
Top patents by PatentIndex Score
26 records- 0172US8344261B2Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2010·Granted Jan 1, 2013·2 cites·3 claims
- 0271US6541527B1Process for preparing post-crosslinked polymer bead whose surface area and pore volume are increasedKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Apr 1, 2003·13 cites·18 claims
- 0367US8156635B2Carrier for manufacturing a printed circuit boardCHO SEONG MIN·Filed 2010·Granted Apr 17, 2012·3 cites·7 claims
- 0464US6063943APolyimide-supported transition metal complex catalyst and process for preparing epoxy compounds using the sameKOREA ADVANCED INST SCI & TECH·Filed 1998·Granted May 16, 2000·10 cites·11 claims
- 0562US8356405B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Granted Jan 22, 2013·2 cites·16 claims
- 0661US11658417B2Antenna substrateSAMSUNG ELECTRO MECH·Filed 2021·Granted May 23, 2023·0 cites·18 claims
- 0760US12341252B2Antenna substrate and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 24, 2025·0 cites·11 claims
- 0860US12119565B2Antenna substrateSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 15, 2024·0 cites·20 claims
- 0960US8418361B2Method of manufacturing printed circuit board having landless via holeLEE SUK WON·Filed 2011·Granted Apr 16, 2013·1 cites·5 claims
- 1056US12446163B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 14, 2025·0 cites·16 claims
- 1154US2009255722A1Printed circuit board having landless via hole and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1254US2009288872A1Printed circuit board including outmost fine circuit pattern and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1354US2009294164A1Printed circuit board including landless via and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1453US11228107B2Antenna substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 1553US2013062112A1Fabrication method for carrier substrate, printed circuit board using the same, and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1653US2012066902A1Method of manufacturing printed circuit board including landless viaKIM HAN·Filed 2011·Application pending·0 cites
- 1752US2012011716A1Method of manufacturing printed circuit board including outmost fine circuit patternKIM HAN·Filed 2011·Application pending·0 cites
- 1849US2009260868A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1947US2011180205A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2045US2014174793A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2142US2012261166A1Printed circuit board and method of manufacturing the sameOH CHANG GUN·Filed 2011·Application pending·0 cites
- 2242US2015351219A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2341US2011315745A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameCHO SEONG MIN·Filed 2011·Application pending·0 cites
- 2439US2011139858A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameCHO SEONG MIN·Filed 2010·Application pending·0 cites
- 2535US2011138615A1Carrier for manufacturing printed circuit board and method of manufacturing the same and method of manufacturing printed circuit board using the sameSOHN KEUNG JIN·Filed 2010·Application pending·0 cites
- 2633US8720049B2Printed circuit board and method for fabricating the sameBAE TAE KYUN·Filed 2011·Granted May 13, 2014·0 cites·7 claims
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