Inventor · disambiguated record
Tae Kyun Bae
Also filed as: BAE TAE KYUN
5 granted patents·6 pending applications·8 citations·filing 2010–2023
70Inventor score
Top patents by PatentIndex Score
11 records- 0168US9516740B2Electronic component embedded substrate and method for manufacturing electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 6, 2016·3 cites·31 claims
- 0267US8156635B2Carrier for manufacturing a printed circuit boardCHO SEONG MIN·Filed 2010·Granted Apr 17, 2012·3 cites·7 claims
- 0362US12284758B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Granted Apr 22, 2025·0 cites·24 claims
- 0462US8356405B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Granted Jan 22, 2013·2 cites·16 claims
- 0547US2011180205A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 0642US2012261166A1Printed circuit board and method of manufacturing the sameOH CHANG GUN·Filed 2011·Application pending·0 cites
- 0742US2015351219A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 0841US2015055309A1Electronic component embedded substrate and method of manufacturing electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0941US2011315745A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameCHO SEONG MIN·Filed 2011·Application pending·0 cites
- 1039US2011139858A1Carrier for manufacturing substrate and method of manufacturing substrate using the sameCHO SEONG MIN·Filed 2010·Application pending·0 cites
- 1133US8720049B2Printed circuit board and method for fabricating the sameBAE TAE KYUN·Filed 2011·Granted May 13, 2014·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →