Inventor · disambiguated record
Shao-Chung Hu
Also filed as: HU SHAO C · HU SHAO CHUNG
14 granted patents·22 pending applications·77 citations·filing 2001–2019
90Inventor score
Files withSUNG CHIEN-MIN10UNITED MICROELECTRONICS CORP8KINIK CO4CHUNG SHAN INST OF SCIENCE3HU SHAO-CHUNG3
Top patents by PatentIndex Score
36 records- 0180US7397124B2Process of metal interconnectsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 8, 2008·8 cites·14 claims
- 0280US6849541B1Method of fabricating a dual damascene copper wireUNITED MICROELECTRONICS CORP·Filed 2003·Granted Feb 1, 2005·29 cites·19 claims
- 0377US7727798B1Method for production of diamond-like carbon film having semiconducting propertyNAT TAIPEI UNIVERSITY TECHNOLO·Filed 2009·Granted Jun 1, 2010·11 cites·14 claims
- 0468US2020156946A1Graphene and hexagonal boron nitride planes and associated methodsSUNG CHIEN MIN·Filed 2019·Application pending·0 cites
- 0565US9006086B2Stress regulated semiconductor devices and associated methodsSUNG CHIEN-MIN·Filed 2012·Granted Apr 14, 2015·2 cites·17 claims
- 0665US8778784B2Stress regulated semiconductor devices and associated methodsSUNG CHIEN-MIN·Filed 2011·Granted Jul 15, 2014·2 cites·17 claims
- 0764US6660627B2Method for planarization of wafers with high selectivitiesUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 9, 2003·9 cites·24 claims
- 0863US6706140B2Control system for in-situ feeding back a polish profileUNITED MICROELECTRONICS CORP·Filed 2001·Granted Mar 16, 2004·9 cites·18 claims
- 0958US9288907B2Microelectronic 3D packaging structure and method of manufacturing the sameCHUNG SHAN INST OF SCIENCE·Filed 2014·Granted Mar 15, 2016·1 cites·14 claims
- 1057US2015079352A1Graphene and hexagonal boron nitride planes and associated methodsSUNG CHIEN-MIN·Filed 2014·Application pending·0 cites
- 1156US2018044185A1Graphene and hexagonal boron nitride planes and associated methodsSUNG CHIEN MIN·Filed 2017·Application pending·0 cites
- 1254US2017022065A1Graphene and hexagonal boron nitride planes and associated methodsSUNG CHIEN-MIN·Filed 2016·Application pending·0 cites
- 1354US2009266599A1Circuit board with high thermal conductivity and method for manufacturing the sameKINIK CO·Filed 2008·Application pending·0 cites
- 1453US8453916B2Thermal conduction device and method for fabricating the sameHU SHAO-CHUNG·Filed 2011·Granted Jun 4, 2013·1 cites·17 claims
- 1550US7867892B2Packaging carrier with high heat dissipation and method for manufacturing the sameKINIK CO·Filed 2008·Granted Jan 11, 2011·1 cites·13 claims
- 1650US6709544B2Chemical mechanical polishing equipmentUNITED MICROELECTRONICS CORP·Filed 2002·Granted Mar 23, 2004·4 cites·20 claims
- 1750US2011011628A1Highly thermal conductive circuit boardKINIK CO·Filed 2009·Application pending·0 cites
- 1848US2010218801A1Graphene and Hexagonal Boron Nitride Planes and Associated MethodsSUNG CHIEN-MIN·Filed 2010·Application pending·0 cites
- 1947US2011204409A1hBN INSULATOR LAYERS AND ASSOCIATED METHODSSUNG CHIEN-MIN·Filed 2011·Application pending·0 cites
- 2043US9087263B2Vision based pedestrian and cyclist detection methodCHUNG SHAN INST OF SCIENCE·Filed 2013·Granted Jul 21, 2015·0 cites·7 claims
- 2143US2015156382A1Multi-channel glare-suppression device of a digital image systemCHUNG SHAN INST OF SCIENCE·Filed 2013·Application pending·0 cites
- 2242US2013216823A1Thermal conduction device and method for fabricating the sameRITEDIA CORP·Filed 2013·Application pending·0 cites
- 2342US2004092112A1Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devicesFiled 2003·Application pending·0 cites
- 2442US2009250248A1Support substrate structure for supporting electronic component thereon and method for fabricating the sameKINIK CO·Filed 2008·Application pending·0 cites
- 2541US2002185224A1Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2002·Application pending·0 cites
- 2640US2005098892A1Structure and process of metal interconnectsFiled 2003·Application pending·0 cites
- 2739US2002162996A1Chemical mechanical polishing system and method for planarizing substrates in fabricating semiconductor devicesFiled 2001·Application pending·0 cites
- 2839US2007035930A1Methods and devices for cooling printed circuit boardsSUNG CHIEN-MIN·Filed 2005·Application pending·0 cites
- 2938US7232752B2Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operationUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jun 19, 2007·0 cites·17 claims
- 3037US2008144291A1Methods and devices for cooling printed circuit boardsHU SHAO CHUNG·Filed 2006·Application pending·0 cites
- 3136US2003015215A1Polishing pad conditioner and application thereofFiled 2001·Application pending·0 cites
- 3236US2003052308A1Slurry composition of chemical mechanical polishingFiled 2001·Application pending·0 cites
- 3335US6696361B2Post-CMP removal of surface contaminants from silicon waferUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 24, 2004·0 cites·8 claims
- 3435US2011127562A1Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated MethodsSUNG CHIEN-MIN·Filed 2010·Application pending·0 cites
- 3534US2002192941A1Method for reducing dishing in copper chemical mechanical polishing processFiled 2001·Application pending·0 cites
- 3634US2011232950A1Substrate and method for manufacturing the sameHU SHAO-CHUNG·Filed 2010·Application pending·0 cites
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