Inventor · disambiguated record
Itaru Matsuo
Also filed as: MATSUO ITARU
10 granted patents·4 pending applications·90 citations·filing 1982–2018
88Inventor score
Files withMITSUBISHI ELECTRIC CORP6RENESAS DEVICE DESIGN CORP2FUJI OIL CO LTD1FUJI STANDARD RES INC1MITSUBISHI ELECTRIC ENG1
Top patents by PatentIndex Score
14 records- 0163US4755124APlastic molding device for a semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Jul 5, 1988·19 cites·8 claims
- 0258US4836909AProcess of thermally cracking heavy petroleum oilRESIDUAL OIL PROC RES ASS·Filed 1987·Granted Jun 6, 1989·19 cites·2 claims
- 0358US4522627AProcess for producing oil-containing, microspherical carbonaceous particlesFUJI STANDARD RES INC·Filed 1982·Granted Jun 11, 1985·10 cites·7 claims
- 0456US4477334AThermal cracking of heavy hydrocarbon oilsFUJI OIL CO LTD·Filed 1984·Granted Oct 16, 1984·13 cites·15 claims
- 0553US5164203APlastic molding device for a semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Nov 17, 1992·16 cites·1 claims
- 0651US6830446B2Clamping apparatusMITSUBISHI ELECTRIC ENG·Filed 2002·Granted Dec 14, 2004·3 cites·4 claims
- 0744US2006237087A1Method of forming leads of a packaged semiconductor deviceRENESAS DEVICE DESIGN CORP·Filed 2006·Application pending·0 cites
- 0842US10252454B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Apr 9, 2019·0 cites·13 claims
- 0942US7077170B2Method of forming leads of a semiconductor deviceRENESAS DEVICE DESIGN CORP·Filed 2003·Granted Jul 18, 2006·2 cites·8 claims
- 1040US6479318B2Method of manufacturing a substrate with directionally anisotropic warpingMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 12, 2002·3 cites·12 claims
- 1136US4904173APlastic molding device for a semiconductor elementMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Feb 27, 1990·5 cites·2 claims
- 1235US2003038363A1Semiconductor device and apparatus for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1335US2004022884A1Resin molding apparatusRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 1429US2003180985A1Method for manufacturing a semiconductor device and a resin sealing device thereforMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →