Inventor · disambiguated record
Mitsuaki Hori
Also filed as: HORI MITSUAKI
24 granted patents·4 pending applications·293 citations·filing 1984–2017
95Inventor score
Files withFUJITSU SEMICONDUCTOR LTD11FUJITSU LTD7NIPPON KOKAN KK4FUJITSU MICROELECTRONICS LTD2HORI MITSUAKI2
Top patents by PatentIndex Score
28 records- 0188US4984829AScrew coupling jointNIPPON KOKAN KK·Filed 1988·Granted Jan 15, 1991·88 cites·4 claims
- 0285US4623173AScrew joint coupling for oil pipesNIPPON KOKAN KK·Filed 1984·Granted Nov 18, 1986·88 cites·6 claims
- 0380US6953727B2Manufacture method of semiconductor device with gate insulating films of different thicknessFUJITSU LTD·Filed 2003·Granted Oct 11, 2005·24 cites·11 claims
- 0479US7514376B2Manufacture of semiconductor device having nitridized insulating filmFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Apr 7, 2009·6 cites·11 claims
- 0576US8778786B1Method for substrate preservation during transistor fabricationSCUDDER LANCE·Filed 2012·Granted Jul 15, 2014·4 cites·19 claims
- 0670US6215163B1Semiconductor device and method of manufacturing the same where the nitrogen concentration in an oxynitride insulating layer is variedFUJITSU LTD·Filed 1997·Granted Apr 10, 2001·36 cites·8 claims
- 0766US8227355B2Method and apparatus of fabricating semiconductor deviceHORI MITSUAKI·Filed 2006·Granted Jul 24, 2012·3 cites·16 claims
- 0865US7678711B2Semiconductor device, and method and apparatus for manufacturing the sameFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Mar 16, 2010·2 cites·6 claims
- 0959US9431285B2Method of manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2012·Granted Aug 30, 2016·2 cites·16 claims
- 1059US7361613B2Semiconductor device, manufacture and evaluation methods for semiconductor device, and process condition evaluation methodFUJITSU LTD·Filed 2006·Granted Apr 22, 2008·1 cites·4 claims
- 1156US10192866B2Semiconductor device and manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2017·Granted Jan 29, 2019·0 cites·7 claims
- 1256US10090201B2Method of manufacturing semiconductor device reducing variation in thickness of silicon layer among semiconductor wafersFUJITSU SEMICONDUCTOR LTD·Filed 2017·Granted Oct 2, 2018·0 cites·3 claims
- 1355US9147744B2Semiconductor device and manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Sep 29, 2015·0 cites·10 claims
- 1453US6800538B2Semiconductor device fabrication method and semiconductor fabrication control methodFUJITSU LTD·Filed 2003·Granted Oct 5, 2004·4 cites·20 claims
- 1552US9691767B2Semiconductor device and manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2015·Granted Jun 27, 2017·0 cites·3 claims
- 1650US9634021B2Method of manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2015·Granted Apr 25, 2017·0 cites·12 claims
- 1748US2014091397A1Semiconductor integrated circuit device and method of manufacturing thereofFUJITSU SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 1848US2016218103A1Semiconductor integrated circuit device and method of manufacturing thereofFUJITSU SEMICONDUCTOR LTD·Filed 2016·Application pending·0 cites
- 1946US9748231B2Semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Aug 29, 2017·0 cites·13 claims
- 2046US8980710B2Manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Mar 17, 2015·0 cites·15 claims
- 2143US5549336AHigh torque tool jointNIPPON KOKAN KK·Filed 1995·Granted Aug 27, 1996·18 cites·3 claims
- 2239US9685442B2Semiconductor device and method of manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2015·Granted Jun 20, 2017·0 cites·16 claims
- 2339US2005151211A1Semiconductor device, and method and apparatus for manufacturing the sameFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2438US7098153B2Semiconductor device, manufacture and evaluation methods for semiconductor device, and process condition evaluation methodFUJITSU LTD·Filed 2003·Granted Aug 29, 2006·0 cites·6 claims
- 2538US5564413AOil well pipe for a casingNIPPON KOKAN KK·Filed 1994·Granted Oct 15, 1996·12 cites·15 claims
- 2637US9153501B2Method for manufacturing semiconductor deviceHORI MITSUAKI·Filed 2011·Granted Oct 6, 2015·0 cites·10 claims
- 2734US6709959B2Semiconductor device having a shallow junction and a fabrication process thereofFUJITSU LTD·Filed 1999·Granted Mar 23, 2004·5 cites·10 claims
- 2834US2004251495A1Semiconductor device and manufacturing method of the sameFiled 2004·Application pending·0 cites
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