Inventor · disambiguated record
Hung-Jung Tu
Also filed as: TU HUNG-JUNG
30 granted patents·2 pending applications·364 citations·filing 2004–2023
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG8ADVANCED SEMICONDUCTOR ENG7TAIWAN SEMICONDUCTOR MFG CO LTD6HU HSIEN-PIN3LO CHING-YU2
Top patents by PatentIndex Score
32 records- 0198US8105875B1Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2010·Granted Jan 31, 2012·192 cites·13 claims
- 0295US11127650B2Semiconductor device package including thermal dissipation element and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 21, 2021·8 cites·19 claims
- 0394US8053277B2Three-dimensional integrated circuits with protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·27 cites·19 claims
- 0493US8759150B2Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2012·Granted Jun 24, 2014·13 cites·13 claims
- 0593US8319349B2Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2012·Granted Nov 27, 2012·13 cites·16 claims
- 0691US7955895B2Structure and method for stacked wafer fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jun 7, 2011·21 cites·10 claims
- 0791US7466028B1Semiconductor contact structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 16, 2008·23 cites·20 claims
- 0889US8264066B2Liner formation in 3DIC structuresLO CHING-YU·Filed 2009·Granted Sep 11, 2012·14 cites·13 claims
- 0989US7812459B2Three-dimensional integrated circuits with protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 12, 2010·21 cites·12 claims
- 1084US8405225B2Three-dimensional integrated circuits with protection layersYU CHEN-HUA·Filed 2012·Granted Mar 26, 2013·9 cites·20 claims
- 1182US8749027B2Robust TSV structureCHEN HSIEN-WEI·Filed 2009·Granted Jun 10, 2014·10 cites·23 claims
- 1272US9305769B2Thin wafer handling methodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 5, 2016·2 cites·20 claims
- 1369US8148826B2Three-dimensional integrated circuits with protection layersYU CHEN-HUA·Filed 2011·Granted Apr 3, 2012·3 cites·20 claims
- 1469US7943421B2Component stacking using pre-formed adhesive filmsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted May 17, 2011·3 cites·20 claims
- 1568US8664749B2Component stacking using pre-formed adhesive filmsWU WENG-JIN·Filed 2011·Granted Mar 4, 2014·2 cites·20 claims
- 1665US10381254B2Wafer debonding and cleaning apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 13, 2019·1 cites·20 claims
- 1764US11631734B2Vertical capacitor structure having capacitor in cavity, and method for manufacturing the vertical capacitor structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 18, 2023·0 cites·15 claims
- 1863US9390949B2Wafer debonding and cleaning apparatus and method of useCHIOU WEN-CHIH·Filed 2011·Granted Jul 12, 2016·1 cites·20 claims
- 1957US10847602B2Vertical capacitor structure having capacitor in cavity and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 24, 2020·0 cites·18 claims
- 2057US9570331B2Wafer cassette with electrostatic carrier charging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 14, 2017·0 cites·20 claims
- 2155US9406650B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·0 cites·20 claims
- 2254US10068789B2Method of using a wafer cassette to charge an electrostatic carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 4, 2018·0 cites·20 claims
- 2353US8629066B2Liner formation in 3DIC structuresLO CHING-YU·Filed 2012·Granted Jan 14, 2014·0 cites·18 claims
- 2452US9806062B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·0 cites·20 claims
- 2551US9093489B2Selective curing method of adhesive on substrateTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·0 cites·24 claims
- 2651US2024371739A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2750US11373956B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 2848US11264262B2Wafer debonding and cleaning apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
- 2947US11189604B2Device assembly structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 30, 2021·0 cites·9 claims
- 3046US7354623B2Surface modification of a porous organic material through the use of a supercritical fluidTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 8, 2008·1 cites·14 claims
- 3143US11201110B2Semiconductor device package with conductive pillars and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 14, 2021·0 cites·16 claims
- 3238US2005158664A1Method of integrating post-etching cleaning process with deposition for semiconductor deviceFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →