Inventor · disambiguated record
Akiko Matsumura
Also filed as: MATSUMURA AKIKO
10 granted patents·3 pending applications·117 citations·filing 1999–2009
88Inventor score
Top patents by PatentIndex Score
13 records- 0187US6492484B2PolycarbodiimideNITTO DENKO CORP·Filed 2001·Granted Dec 10, 2002·25 cites·13 claims
- 0284US6394821B1Anisotropic conductive film and production method thereofNITTO DENKO CORP·Filed 2000·Granted May 28, 2002·34 cites·6 claims
- 0376US6248857B1Aromatic polycarbodiimide and polycarbodiimide sheetNITTO DENKO CORP·Filed 1999·Granted Jun 19, 2001·16 cites·9 claims
- 0474US6652688B2Process for producing semiconductor wafer with adhesive filmNITTO DENKO CORP·Filed 2002·Granted Nov 25, 2003·21 cites·10 claims
- 0562US6538309B1Semiconductor device and circuit board for mounting semiconductor elementNITTO DENKO CORP·Filed 2000·Granted Mar 25, 2003·11 cites·9 claims
- 0655US6846550B2Adhesive film for underfill and semiconductor device using the sameNITTO DENKO CORP·Filed 2003·Granted Jan 25, 2005·7 cites·4 claims
- 0749US6709606B2Anisotropic conductive film and production method thereofNITTO DENKO CORP·Filed 2002·Granted Mar 23, 2004·3 cites·5 claims
- 0842US2005049385A1Thermosetting resinNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 0941US7487586B2Process for producing semiconductor deviceNITTO DENKO CORP·Filed 2003·Granted Feb 10, 2009·0 cites·5 claims
- 1040US8310714B2Print control apparatus for controlling printing of an auxiliary image based on a number of sheets to be printedMATSUMURA AKIKO·Filed 2009·Granted Nov 13, 2012·0 cites·13 claims
- 1139US2003068841A1Process of producing semiconductor device and resin composition sheet used thereforNITTO DENKO CORP·Filed 2002·Application pending·0 cites
- 1237US7018718B2Adhesive film for underfill and semiconductor device using the sameNITTO DENKO CORP·Filed 2004·Granted Mar 28, 2006·0 cites·4 claims
- 1337US2004140482A1Semiconductor device and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →