Inventor · disambiguated record
Kojiro Kameyama
Also filed as: KAMEYAMA KOJIRO
15 granted patents·2 pending applications·175 citations·filing 2005–2012
93Inventor score
Top patents by PatentIndex Score
17 records- 0196US7339273B2Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrodeSANYO ELECTRIC CO·Filed 2005·Granted Mar 4, 2008·46 cites·9 claims
- 0295US7582971B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2005·Granted Sep 1, 2009·40 cites·10 claims
- 0391US7485967B2Semiconductor device with via hole for electric connectionSANYO ELECTRIC CO·Filed 2006·Granted Feb 3, 2009·20 cites·6 claims
- 0490US7646100B2Semiconductor device with penetrating electrodeSANYO ELECTRIC CO·Filed 2005·Granted Jan 12, 2010·22 cites·6 claims
- 0586US9466994B2Mobile terminal power receiving module utilizing wireless power transmission and mobile terminal rechargeable battery including mobile terminal power receiving moduleNITTO DENKO CORP·Filed 2012·Granted Oct 11, 2016·8 cites·10 claims
- 0686US7670955B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2008·Granted Mar 2, 2010·12 cites·6 claims
- 0776US7906430B2Method of manufacturing a semiconductor device with a peeling prevention layerSANYO ELECTRIC CO·Filed 2008·Granted Mar 15, 2011·6 cites·6 claims
- 0874US7759247B2Manufacturing method of semiconductor device with a barrier layer and a metal layerSANYO ELECTRIC CO·Filed 2007·Granted Jul 20, 2010·5 cites·14 claims
- 0969US8154129B2Electrode structure and semiconductor deviceOKADA KIKUO·Filed 2008·Granted Apr 10, 2012·5 cites·6 claims
- 1068US7382037B2Semiconductor device with a peeling prevention layerSANYO ELECTRIC CO·Filed 2005·Granted Jun 3, 2008·3 cites·7 claims
- 1167US7659576B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2007·Granted Feb 9, 2010·4 cites·9 claims
- 1267US7495881B2Chucking method and processing method using the sameSANYO ELECTRIC CO·Filed 2005·Granted Feb 24, 2009·2 cites·32 claims
- 1358US9165898B2Method of manufacturing semiconductor device with through holeKAMEYAMA KOJIRO·Filed 2008·Granted Oct 20, 2015·2 cites·11 claims
- 1458US2013139874A1Conductive adhesive sheet, method for producing the same, collector electrode, and solar cell moduleNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1552US7820548B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2007·Granted Oct 26, 2010·0 cites·9 claims
- 1649US7256420B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Aug 14, 2007·0 cites·8 claims
- 1740US2010044839A1Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →