Inventor · disambiguated record
Jaime A. Bayan
Also filed as: BAYAN JAIME · BAYAN JAIME A
63 granted patents·7 pending applications·1,837 citations·filing 1991–2013
99Inventor score
Top patents by PatentIndex Score
70 records- 0199US6348726B1Multi row leadless leadframe packageNAT SEMICONDUCTOR CORP·Filed 2001·Granted Feb 19, 2002·264 cites·12 claims
- 0296US8679896B2DC/DC converter power module package incorporating a stacked controller and construction methodologyNAT SEMICONDUCTOR CORP·Filed 2013·Granted Mar 25, 2014·23 cites·7 claims
- 0396US7619303B2Integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2007·Granted Nov 17, 2009·45 cites·24 claims
- 0495US7608482B1Integrated circuit package with molded insulationNAT SEMICONDUCTOR CORP·Filed 2006·Granted Oct 27, 2009·33 cites·8 claims
- 0595US6872599B1Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)NAT SEMICONDUCTOR CORP·Filed 2002·Granted Mar 29, 2005·94 cites·13 claims
- 0694US7023074B2Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)NAT SEMICONDUCTOR CORP·Filed 2005·Granted Apr 4, 2006·32 cites·6 claims
- 0794US6399415B1Electrical isolation in panels of leadless IC packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 4, 2002·145 cites·10 claims
- 0893US6777788B1Method and structure for applying thick solder layer onto die attach padNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 17, 2004·96 cites·15 claims
- 0992US7102209B1Substrate for use in semiconductor manufacturing and method of making sameNAT SEMICONDUCTOR CORP·Filed 2003·Granted Sep 5, 2006·91 cites·28 claims
- 1092US6781243B1Leadless leadframe package substitute and stack packageNAT SEMICONDUCTOR CORP·Filed 2003·Granted Aug 24, 2004·67 cites·25 claims
- 1192US6452255B1Low inductance leadless packageNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 17, 2002·103 cites·11 claims
- 1291US7705476B2Integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2007·Granted Apr 27, 2010·23 cites·23 claims
- 1391US6664615B1Method and apparatus for lead-frame based grid array IC packagingNAT SEMICONDUCTOR CORP·Filed 2001·Granted Dec 16, 2003·68 cites·22 claims
- 1491US6372539B1Leadless packaging process using a conductive substrateNAT SEMICONDUCTOR CORP·Filed 2000·Granted Apr 16, 2002·71 cites·14 claims
- 1589US7836586B2Thin foil semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Nov 23, 2010·15 cites·11 claims
- 1686US7678617B1Universal laminatorNAT SEMICONDUCTOR CORP·Filed 2006·Granted Mar 16, 2010·14 cites·10 claims
- 1785US7671452B1Microarray package with plated contact pedestalsNAT SEMICONDUCTOR CORP·Filed 2007·Granted Mar 2, 2010·10 cites·4 claims
- 1884US7045035B1Post singulation die separation apparatus and method for bulk feeding operationNAT SEMICONDUCTOR CORP·Filed 2005·Granted May 16, 2006·8 cites·15 claims
- 1984US6674156B1Multiple row fine pitch leadless leadframe package with use of half-etch processNAT SEMICONDUCTOR CORP·Filed 2001·Granted Jan 6, 2004·39 cites·21 claims
- 2083US6448107B1Pin indicator for leadless leadframe packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·39 cites·16 claims
- 2182US8450149B2Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodologyBAYAN JAIME A·Filed 2011·Granted May 28, 2013·13 cites·11 claims
- 2282US7087986B1Solder pad configuration for use in a micro-array integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 8, 2006·33 cites·19 claims
- 2381US7227245B1Die attach pad for use in semiconductor manufacturing and method of making sameNAT SEMICONDUCTOR CORP·Filed 2004·Granted Jun 5, 2007·39 cites·16 claims
- 2479US7491625B2Gang flipping for IC packagingNAT SEMICONDUCTOR CORP·Filed 2007·Granted Feb 17, 2009·9 cites·13 claims
- 2579US6932136B1Post singulation die separation apparatus and method for bulk feeding operationNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·19 cites·20 claims
- 2679US6916688B1Apparatus and method for a wafer level chip scale package heat sinkNAT SEMICONDUCTOR CORP·Filed 2002·Granted Jul 12, 2005·25 cites·13 claims
- 2778US8222716B2Multiple leadframe packageBAYAN JAIME A·Filed 2009·Granted Jul 17, 2012·6 cites·20 claims
- 2878US6686652B1Locking lead tips and die attach pad for a leadless package apparatus and methodNAT SEMICONDUCTOR CORP·Filed 2000·Granted Feb 3, 2004·31 cites·29 claims
- 2976US7598122B1Die attach method and microarray leadframe structureNAT SEMICONDUCTOR CORP·Filed 2006·Granted Oct 6, 2009·7 cites·5 claims
- 3076US7186588B1Method of fabricating a micro-array integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Mar 6, 2007·27 cites·7 claims
- 3176US6364089B1Multi-station rotary die handling deviceNAT SEMICONDUCTOR CORP·Filed 1999·Granted Apr 2, 2002·46 cites·28 claims
- 3275US8101470B2Foil based semiconductor packagePODDAR ANINDYA·Filed 2009·Granted Jan 24, 2012·7 cites·19 claims
- 3375US6617197B1Multi row leadless leadframe packageNAT SEMICONDUCTOR CORP·Filed 2001·Granted Sep 9, 2003·19 cites·10 claims
- 3475US6483180B1Lead frame design for burr-free singulation of molded array packagesNAT SEMICONDUCTOR CORP·Filed 1999·Granted Nov 19, 2002·48 cites·9 claims
- 3575US5569956AInterposer connecting leadframe and integrated circuitNAT SEMICONDUCTOR CORP·Filed 1995·Granted Oct 29, 1996·51 cites·13 claims
- 3673US6797540B1Dap isolation processNAT SEMICONDUCTOR CORP·Filed 2002·Granted Sep 28, 2004·28 cites·8 claims
- 3772US7923825B2Integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2009·Granted Apr 12, 2011·4 cites·15 claims
- 3872US7064419B1Die attach region for use in a micro-array integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Jun 20, 2006·23 cites·19 claims
- 3970US6930377B1Using adhesive materials as insulation coatings for leadless lead frame semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 16, 2005·16 cites·8 claims
- 4067US6551048B1Off-load system for semiconductor devicesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Apr 22, 2003·11 cites·34 claims
- 4165US7944032B2Integrated circuit package with molded insulationNAT SEMICONDUCTOR CORP·Filed 2009·Granted May 17, 2011·2 cites·22 claims
- 4264US6677667B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jan 13, 2004·11 cites·34 claims
- 4363US7612435B2Method of packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2007·Granted Nov 3, 2009·2 cites·17 claims
- 4462US7859090B2Die attach method and leadframe structureNAT SEMICONDUCTOR CORP·Filed 2009·Granted Dec 28, 2010·2 cites·8 claims
- 4562US6576989B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 10, 2003·10 cites·21 claims
- 4661US8298871B2Method and leadframe for packaging integrated circuitsWONG WILL K·Filed 2011·Granted Oct 30, 2012·2 cites·12 claims
- 4760US5146310AThermally enhanced leadframeNAT SEMICONDUCTOR CORP·Filed 1991·Granted Sep 8, 1992·29 cites·6 claims
- 4858US8375577B2Method of making foil based semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Feb 19, 2013·1 cites·11 claims
- 4953US8857047B2Thin foil semiconductor packageTEXAS INSTRUMENTS INC·Filed 2012·Granted Oct 14, 2014·0 cites·6 claims
- 5053US8377267B2Foil plating for semiconductor packagingNAT SEMICONDUCTOR CORP·Filed 2009·Granted Feb 19, 2013·0 cites·11 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →