Inventor · disambiguated record
Arnel Senosa Trasporto
Also filed as: TRASPORTO ARNEL · TRASPORTO ARNEL SENOSA
83 granted patents·8 pending applications·568 citations·filing 2001–2016
99Inventor score
Files withDO BYUNG TAI37STATS CHIPPAC LTD26CAMACHO ZIGMUND RAMIREZ12CAMACHO ZIGMUND R4BATHAN HENRY DESCALZO3
Top patents by PatentIndex Score
91 records- 0197US7851246B2Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the deviceSTATS CHIPPAC LTD·Filed 2007·Granted Dec 14, 2010·40 cites·18 claims
- 0296US7977579B2Multiple flip-chip integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 12, 2011·40 cites·20 claims
- 0395US6380048B1Die paddle enhancement for exposed pad in semiconductor packagingST ASSEMBLY TEST SERVICES PTE·Filed 2001·Granted Apr 30, 2002·228 cites·16 claims
- 0491US8735224B2Integrated circuit packaging system with routed circuit lead array and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted May 27, 2014·10 cites·10 claims
- 0591US7790576B2Semiconductor device and method of forming through hole vias in die extension region around periphery of dieSTATS CHIPPAC LTD·Filed 2007·Granted Sep 7, 2010·15 cites·18 claims
- 0690US7868471B2Integrated circuit package-in-package system with leadsSTATS CHIPPAC LTD·Filed 2007·Granted Jan 11, 2011·22 cites·8 claims
- 0788US9368423B2Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die packageSTATS CHIPPAC LTD·Filed 2013·Granted Jun 14, 2016·10 cites·34 claims
- 0888US8937379B1Integrated circuit packaging system with trenched leadframe and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Jan 20, 2015·10 cites·9 claims
- 0987US10068862B2Semiconductor device and method of forming a package in-fan out packageSTATS CHIPPAC LTD·Filed 2016·Granted Sep 4, 2018·5 cites·25 claims
- 1086US8519518B2Integrated circuit packaging system with lead encapsulation and method of manufacture thereofDO BYUNG TAI·Filed 2010·Granted Aug 27, 2013·8 cites·16 claims
- 1186US8120149B2Integrated circuit package systemCAMACHO ZIGMUND RAMIREZ·Filed 2006·Granted Feb 21, 2012·14 cites·20 claims
- 1285US8120156B2Integrated circuit package system with die on base packageCAMACHO ZIGMUND RAMIREZ·Filed 2006·Granted Feb 21, 2012·13 cites·20 claims
- 1383US7919850B2Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereofSTATS CHIPPAC LTD·Filed 2008·Granted Apr 5, 2011·12 cites·20 claims
- 1483US7750451B2Multi-chip package system with multiple substratesSTATS CHIPPAC LTD·Filed 2007·Granted Jul 6, 2010·11 cites·20 claims
- 1582US8623708B1Integrated circuit packaging system with grid-array mechanism and method of manufacture thereofDO BYUNG TAI·Filed 2012·Granted Jan 7, 2014·6 cites·5 claims
- 1680US7777310B2Integrated circuit package system with integral inner lead and paddleSTATS CHIPPAC LTD·Filed 2007·Granted Aug 17, 2010·7 cites·15 claims
- 1778US9177897B1Integrated circuit packaging system with trace protection layer and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Nov 3, 2015·4 cites·20 claims
- 1878US8623711B2Integrated circuit packaging system with package-on-package and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Jan 7, 2014·4 cites·8 claims
- 1978US8134242B2Integrated circuit package system with concave terminalCAMACHO ZIGMUND RAMIREZ·Filed 2008·Granted Mar 13, 2012·7 cites·20 claims
- 2077US7449369B2Integrated circuit package system with multiple moldingSTATS CHIPPAC LTD·Filed 2006·Granted Nov 11, 2008·6 cites·11 claims
- 2177US7365417B2Overhang integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Apr 29, 2008·7 cites·17 claims
- 2276US7919360B1Integrated circuit packaging system with circuitry stacking and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Apr 5, 2011·6 cites·17 claims
- 2375US9123712B1Leadframe system with warp control mechanism and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Sep 1, 2015·3 cites·20 claims
- 2475US7759806B2Integrated circuit package system with multiple device unitsSTATS CHIPPAC LTD·Filed 2007·Granted Jul 20, 2010·5 cites·12 claims
- 2575US7541221B2Integrated circuit package system with leadfinger supportSTATS CHIPPAC LTD·Filed 2006·Granted Jun 2, 2009·5 cites·8 claims
- 2674US8476772B2Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor dieDO BYUNG TAI·Filed 2010·Granted Jul 2, 2013·3 cites·28 claims
- 2774US7977779B2Mountable integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jul 12, 2011·5 cites·20 claims
- 2873US9190349B1Integrated circuit packaging system with leadframe and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Nov 17, 2015·3 cites·20 claims
- 2973US9105620B1Integrated circuit packaging system with routable traces and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Aug 11, 2015·3 cites·20 claims
- 3073US8802501B2Integrated circuit packaging system with island terminals and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Aug 12, 2014·3 cites·22 claims
- 3172US8592252B2Semiconductor device and method of forming through hole vias in die extension region around periphery of dieBATHAN HENRY DESCALZO·Filed 2010·Granted Nov 26, 2013·2 cites·25 claims
- 3271US8779565B2Integrated circuit mounting system with paddle interlock and method of manufacture thereofHAN BYUNG JOON·Filed 2010·Granted Jul 15, 2014·3 cites·20 claims
- 3370US8633578B2Integrated circuit package system with laminate baseCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Jan 21, 2014·2 cites·9 claims
- 3470US8138027B2Optical semiconductor device having pre-molded leadframe with window and method thereforCAMACHO ZIGMUND R·Filed 2008·Granted Mar 20, 2012·3 cites·31 claims
- 3569US9620480B1Integrated circuit packaging system with unplated leadframe and method of manufacture thereofDIMACULANGAN GARRET·Filed 2013·Granted Apr 11, 2017·4 cites·10 claims
- 3669US8987064B2Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Mar 24, 2015·2 cites·20 claims
- 3769US8629567B2Integrated circuit packaging system with contacts and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Jan 14, 2014·2 cites·10 claims
- 3869US7993939B2Integrated circuit package system with laminate baseSTATS CHIPPAC LTD·Filed 2006·Granted Aug 9, 2011·3 cites·10 claims
- 3968US8513788B2Integrated circuit packaging system with pad and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Aug 20, 2013·2 cites·20 claims
- 4067US9312194B2Integrated circuit packaging system with terminals and method of manufacture thereofDO BYUNG TAI·Filed 2012·Granted Apr 12, 2016·2 cites·8 claims
- 4167US8957509B2Integrated circuit packaging system with thermal emission and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Feb 17, 2015·2 cites·7 claims
- 4267US7671463B2Integrated circuit package system with ground ringSTATS CHIPPAC LTD·Filed 2006·Granted Mar 2, 2010·3 cites·20 claims
- 4366US9219029B2Integrated circuit packaging system with terminals and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Dec 22, 2015·2 cites·20 claims
- 4465US9397236B2Optical semiconductor device having pre-molded leadframe with window and method thereforSTATS CHIPPAC LTD·Filed 2013·Granted Jul 19, 2016·1 cites·16 claims
- 4564US8866248B2Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the deviceCAMACHO ZIGMUND R·Filed 2010·Granted Oct 21, 2014·1 cites·28 claims
- 4663US9147662B1Integrated circuit packaging system with fiber-less substrate and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Sep 29, 2015·1 cites·20 claims
- 4763US8258609B2Integrated circuit package system with lead supportCAMACHO ZIGMUND RAMIREZ·Filed 2007·Granted Sep 4, 2012·2 cites·18 claims
- 4863US7989931B2Integrated circuit package system with under paddle leadfingersSTATS CHIPPAC LTD·Filed 2007·Granted Aug 2, 2011·2 cites·10 claims
- 4962US8791556B2Integrated circuit packaging system with routable circuitry and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2013·Granted Jul 29, 2014·1 cites·18 claims
- 5062US8669654B2Integrated circuit packaging system with die paddle and method of manufacture thereofDO BYUNG TAI·Filed 2011·Granted Mar 11, 2014·1 cites·20 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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