Inventor · disambiguated record
Weng F. Yap
Also filed as: YAP WENG F · YAP WENG FOONG
39 granted patents·4 pending applications·328 citations·filing 2011–2020
97Inventor score
Top patents by PatentIndex Score
43 records- 0198US9698104B2Integrated electronic package and stacked assembly thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Jul 4, 2017·37 cites·15 claims
- 0298US9396999B2Wafer level packaging methodFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 19, 2016·46 cites·11 claims
- 0397US9299670B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Mar 29, 2016·39 cites·20 claims
- 0495US9607918B2Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Mar 28, 2017·13 cites·20 claims
- 0595US9257393B1Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereofGONG ZHIWEI·Filed 2014·Granted Feb 9, 2016·18 cites·18 claims
- 0693US9595509B1Stacked microelectronic package assemblies and methods for the fabrication thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Mar 14, 2017·10 cites·20 claims
- 0791US9589909B1Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layersFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Mar 7, 2017·9 cites·12 claims
- 0891US9209081B2Semiconductor grid array packageLIM FUI YEE·Filed 2013·Granted Dec 8, 2015·37 cites·16 claims
- 0990US9129981B2Methods for the production of microelectronic packages having radiofrequency stand-off layersYAP WENG F·Filed 2013·Granted Sep 8, 2015·11 cites·20 claims
- 1089US9362234B2Shielded device packages having antennas and related fabrication methodsPABST EDUARD J·Filed 2014·Granted Jun 7, 2016·19 cites·19 claims
- 1189US9281284B2System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Mar 8, 2016·11 cites·19 claims
- 1288US9761569B2Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 12, 2017·5 cites·20 claims
- 1387US9472528B2Integrated electronic package and method of fabricationFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 18, 2016·8 cites·10 claims
- 1484US9281286B1Microelectronic packages having texturized solder pads and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Mar 8, 2016·7 cites·20 claims
- 1582US9257419B2Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereofYAP WENG F·Filed 2014·Granted Feb 9, 2016·5 cites·20 claims
- 1682US9123685B2Microelectronic packages having frontside thermal contacts and methods for the fabrication thereofYAP WENG FOONG·Filed 2013·Granted Sep 1, 2015·6 cites·20 claims
- 1782US9024429B2Microelectronic packages containing opposing devices and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted May 5, 2015·6 cites·20 claims
- 1875US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 1975US9025340B2Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabricationWRIGHT JASON R·Filed 2013·Granted May 5, 2015·5 cites·4 claims
- 2075US8927345B2Device package with rigid interconnect structure connecting die and substrate and method thereofYAP WENG FOONG·Filed 2012·Granted Jan 6, 2015·6 cites·19 claims
- 2174US9305911B2Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted Apr 5, 2016·3 cites·20 claims
- 2274US9029202B2Method of forming a high thermal conducting semiconductor device packageFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted May 12, 2015·3 cites·20 claims
- 2373US9401339B2Wafer level packages having non-wettable solder collars and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Jul 26, 2016·3 cites·20 claims
- 2472US10822224B2Packaged pressure sensor deviceNXP USA INC·Filed 2017·Granted Nov 3, 2020·1 cites·12 claims
- 2572US8980696B2Method of packaging semiconductor dieMENG DOMINIC KOEY POH·Filed 2011·Granted Mar 17, 2015·6 cites·16 claims
- 2667US9997492B2Optically-masked microelectronic packages and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Jun 12, 2018·2 cites·20 claims
- 2767US8963318B2Packaged semiconductor deviceYAP WENG F·Filed 2013·Granted Feb 24, 2015·2 cites·17 claims
- 2864US11427464B2Packaged pressure sensor deviceNXP USA INC·Filed 2020·Granted Aug 30, 2022·0 cites·10 claims
- 2962US9524950B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Dec 20, 2016·1 cites·18 claims
- 3061US9018045B2Microelectronic packages and methods for the fabrication thereofYAP WENG FOONG·Filed 2013·Granted Apr 28, 2015·1 cites·20 claims
- 3161US8680660B1Brace for bond wireLAW LAI CHENG·Filed 2013·Granted Mar 25, 2014·3 cites·20 claims
- 3260US8927417B2Semiconductor package signal routing using conductive viasYAP WENG FOONG·Filed 2012·Granted Jan 6, 2015·1 cites·13 claims
- 3349US9343414B2Microelectronic packages having radio frequency stand-off layersFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 17, 2016·0 cites·20 claims
- 3445US9312206B2Semiconductor package with thermal via and method for fabrication thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Apr 12, 2016·0 cites·12 claims
- 3544US9780077B2System-in-packages containing preassembled surface mount device modules and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 3, 2017·0 cites·19 claims
- 3644US9281293B2Microelectronic packages having layered interconnect structures and methods for the manufacture thereofMAGNUS ALAN J·Filed 2013·Granted Mar 8, 2016·0 cites·20 claims
- 3744US2015187675A1Methods and apparatus for dissipating heat from a die assemblyTANG JINBANG·Filed 2013·Application pending·0 cites
- 3842US2015076700A1System-in-packages containing embedded surface mount devices and methods for the fabrication thereofYAP WENG FOONG·Filed 2013·Application pending·0 cites
- 3940US9786515B1Semiconductor device package and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 10, 2017·0 cites·20 claims
- 4039US8741666B1Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wiresYAP WENG F·Filed 2013·Granted Jun 3, 2014·0 cites·20 claims
- 4138US10319689B2Antenna assembly for wafer level packagingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 11, 2019·0 cites·22 claims
- 4236US2017345746A1Integrated circuit package with solder balls on two sidesFREESCALE SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
- 4335US2013341378A1System and method for inspecting free air ballLEE SEOK KHOON·Filed 2012·Application pending·0 cites
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