Inventor · disambiguated record
Tonny Kamphuis
Also filed as: KAMPHUIS TONNY
17 granted patents·5 pending applications·77 citations·filing 2008–2017
92Inventor score
Top patents by PatentIndex Score
22 records- 0193US9466585B1Reducing defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Oct 11, 2016·17 cites·12 claims
- 0292US10177111B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2017·Granted Jan 8, 2019·10 cites·12 claims
- 0390US9704823B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Jul 11, 2017·8 cites·4 claims
- 0488US8987057B2Encapsulated wafer-level chip scale (WLSCP) pedestal packagingNXP BV·Filed 2013·Granted Mar 24, 2015·8 cites·11 claims
- 0583US9196537B2Protection of a wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Nov 24, 2015·6 cites·15 claims
- 0682US9379071B2Single inline no-lead semiconductor packageNXP BV·Filed 2014·Granted Jun 28, 2016·7 cites·19 claims
- 0777US9245804B2Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Jan 26, 2016·4 cites·9 claims
- 0874US9424507B2Dual interface IC card components and method for manufacturing the dual-interface IC card componentsNXP BV·Filed 2014·Granted Aug 23, 2016·5 cites·20 claims
- 0972US10109564B2Wafer level chip scale semiconductor packageNXP BV·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 1072US9798228B2Maximizing potential good die per wafer, PGDWNXP BV·Filed 2015·Granted Oct 24, 2017·3 cites·14 claims
- 1168US8895357B2Integrated circuit and method of manufacturing the sameNXP BV·Filed 2013·Granted Nov 25, 2014·2 cites·9 claims
- 1267US9842776B2Integrated circuits and molding approaches thereforNXP BV·Filed 2016·Granted Dec 12, 2017·2 cites·18 claims
- 1361US8349708B2Integrated circuits on a wafer and methods for manufacturing integrated circuitsNXP BV·Filed 2008·Granted Jan 8, 2013·1 cites·12 claims
- 1460US8679963B2Fan-out chip scale packageNXP BV·Filed 2013·Granted Mar 25, 2014·2 cites·14 claims
- 1551US2015069587A1Integrated circuit and method of manufacturing the sameNXP BV·Filed 2014·Application pending·0 cites
- 1645US2015162306A1Encapsulated wafer-level chip scale (wlscp) pedestal packagingNXP BV·Filed 2015·Application pending·0 cites
- 1743US8482136B2Fan-out chip scale packageGULPEN JAN·Filed 2009·Granted Jul 9, 2013·0 cites·23 claims
- 1843US2016005653A1Flexible wafer-level chip-scale packages with improved board-level reliabilityNXP BV·Filed 2014·Application pending·0 cites
- 1939US2016005680A1Exposed-Heatsink Quad Flat No-Leads (QFN) PackageNXP BV·Filed 2014·Application pending·0 cites
- 2033US11011446B2Semiconductor device and method of making a semiconductor deviceNexperia BV·Filed 2016·Granted May 18, 2021·0 cites·6 claims
- 2132US2017103939A1Ultrathin routable quad flat no-leads (qfn) packageNXP BV·Filed 2015·Application pending·0 cites
- 2228US9953903B2Heatsink very-thin quad flat no-leads (HVQFN) packageNXP BV·Filed 2015·Granted Apr 24, 2018·0 cites·11 claims
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