Inventor · disambiguated record
Christian Zenz
Also filed as: ZENZ CHRISTIAN
19 granted patents·5 pending applications·59 citations·filing 2005–2019
92Inventor score
Top patents by PatentIndex Score
24 records- 0188US8987057B2Encapsulated wafer-level chip scale (WLSCP) pedestal packagingNXP BV·Filed 2013·Granted Mar 24, 2015·8 cites·11 claims
- 0286US9779349B2Method of producing a transponder and a transponderNXP BV·Filed 2015·Granted Oct 3, 2017·6 cites·9 claims
- 0386US8628018B2RFID circuit and methodZENZ CHRISTIAN·Filed 2012·Granted Jan 14, 2014·10 cites·20 claims
- 0483US9196537B2Protection of a wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Nov 24, 2015·6 cites·15 claims
- 0577US9245804B2Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Jan 26, 2016·4 cites·9 claims
- 0674US9424507B2Dual interface IC card components and method for manufacturing the dual-interface IC card componentsNXP BV·Filed 2014·Granted Aug 23, 2016·5 cites·20 claims
- 0772US9536188B2Dual-interface IC card components and method for manufacturing the dual-interface IC card componentsNXP BV·Filed 2015·Granted Jan 3, 2017·3 cites·18 claims
- 0872US8968510B2Method of producing a transponder and a transponderROGY REINHARD·Filed 2006·Granted Mar 3, 2015·6 cites·9 claims
- 0965US8884415B2IC package with stainless steel leadframeNXP BV·Filed 2013·Granted Nov 11, 2014·3 cites·20 claims
- 1064US10366320B2Dual-interface IC cardNXP BV·Filed 2016·Granted Jul 30, 2019·1 cites·13 claims
- 1162US8844826B2Integrated circuit transponder, method of producing an integrated circuit and method of producing a transponderROGY REINARD·Filed 2007·Granted Sep 30, 2014·5 cites·18 claims
- 1261US8695207B2Method for manufacturing an electronic deviceZENZ CHRISTIAN·Filed 2009·Granted Apr 15, 2014·2 cites·15 claims
- 1357US11222861B2Dual-interface IC card moduleNXP BV·Filed 2019·Granted Jan 11, 2022·0 cites·7 claims
- 1455US10461057B2Dual-interface IC card moduleNXP BV·Filed 2016·Granted Oct 29, 2019·0 cites·15 claims
- 1548US10896878B2Integrated circuit saw bow break pointNXP BV·Filed 2019·Granted Jan 19, 2021·0 cites·15 claims
- 1646US2011073357A1Electronic device and method of manufacturing an electronic deviceNXP BV·Filed 2009·Application pending·0 cites
- 1745US2015162306A1Encapsulated wafer-level chip scale (wlscp) pedestal packagingNXP BV·Filed 2015·Application pending·0 cites
- 1843US9425500B2Antenna or a strap for accommodating an integrated circuit, an antenna on a substrate, a strap for an integrated circuit and a transponderZENZ CHRISTIAN·Filed 2008·Granted Aug 23, 2016·0 cites·12 claims
- 1942US8669123B2Method of and device for determining and controlling the distance between an integrated circuit and a substrateZENZ CHRISTIAN·Filed 2008·Granted Mar 11, 2014·0 cites·11 claims
- 2042US2014110826A1Backside protection for a wafer-level chip scale package (wlcsp)NXP BV·Filed 2013·Application pending·0 cites
- 2142US2008093712A1Chip with Light Protection LayerKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Application pending·0 cites
- 2239US2010310124A1Method of and device for determining the distance between an integrated circuit and a substrateNXP BV·Filed 2008·Application pending·0 cites
- 2337US8448870B2Transponder and method of producing a transponderROGY REINARD·Filed 2007·Granted May 28, 2013·0 cites·19 claims
- 2434US8695881B2Chip card for insertion into a holderSCHOBER JOACHIM HEINZ·Filed 2005·Granted Apr 15, 2014·0 cites·13 claims
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