Inventor · disambiguated record
Matthew M. Salatino
Also filed as: SALATINO MATTHEW · SALATINO MATTHEW M
20 granted patents·2,379 citations·filing 1990–2014
97Inventor score
Top patents by PatentIndex Score
20 records- 0198US5915168ALid wafer bond packaging and micromachiningHARRIS CORP·Filed 1998·Granted Jun 22, 1999·344 cites·30 claims
- 0298US5117282AStacked configuration for integrated circuit devicesHARRIS CORP·Filed 1990·Granted May 26, 1992·261 cites·8 claims
- 0395US5920640AFingerprint sensor and token reader and associated methodsHARRIS CORP·Filed 1997·Granted Jul 6, 1999·423 cites·42 claims
- 0495US5798557ALid wafer bond packaging and micromachiningHARRIS CORP·Filed 1996·Granted Aug 25, 1998·192 cites·16 claims
- 0593US6667439B2Integrated circuit package including opening exposing portion of an ICAUTHENTEC INC·Filed 2001·Granted Dec 23, 2003·84 cites·58 claims
- 0693US5862248AIntegrated circuit device having an opening exposing the integrated circuit die and related methodsHARRIS CORP·Filed 1996·Granted Jan 19, 1999·199 cites·39 claims
- 0792US7424136B2Finger sensing with enhanced mounting and associated methodsAUTHENTEC INC·Filed 2006·Granted Sep 9, 2008·32 cites·30 claims
- 0892US6628812B1Fingerprint sensor package having enhanced electrostatic discharge protection and associated methodsAUTHENTEC INC·Filed 2000·Granted Sep 30, 2003·151 cites·24 claims
- 0992US5887343ADirect chip attachment methodHARRIS CORP·Filed 1997·Granted Mar 30, 1999·166 cites·32 claims
- 1091US8085998B2Finger sensor including enhanced ESD protection and associated methodsSETLAK DALE R·Filed 2006·Granted Dec 27, 2011·29 cites·30 claims
- 1190US8736001B2Finger sensor including encapsulating layer over sensing area and related methodsSALATINO MATTHEW·Filed 2011·Granted May 27, 2014·41 cites·43 claims
- 1288US7049166B2Methods and apparatus for making integrated circuit package including opening exposing portion of the ICHESTIA TECHNOLOGIES INC·Filed 2001·Granted May 23, 2006·51 cites·29 claims
- 1387US6069970AFingerprint sensor and token reader and associated methodsAUTHENTEC INC·Filed 1999·Granted May 30, 2000·159 cites·24 claims
- 1482US7894643B2Finger sensor including flexible circuit and associated methodsAUTHENTEC INC·Filed 2006·Granted Feb 22, 2011·12 cites·28 claims
- 1582US7076089B2Fingerprint sensor having enhanced ESD protection and associated methodsAUTHENTEC INC·Filed 2002·Granted Jul 11, 2006·41 cites·48 claims
- 1681US6088471AFingerprint sensor including an anisotropic dielectric coating and associated methodsAUTHENTEC INC·Filed 1997·Granted Jul 11, 2000·124 cites·58 claims
- 1781US5228192AMethod of manufacturing a multi-layered ic packaging assemblyHARRIS CORP·Filed 1992·Granted Jul 20, 1993·49 cites·8 claims
- 1877US7599532B2Finger sensing with enhanced mounting and associated methodsAUTHENTEC INC·Filed 2008·Granted Oct 6, 2009·8 cites·21 claims
- 1961US9613249B2Finger sensor including encapsulating layer over sensing area and related methodsAPPLE INC·Filed 2014·Granted Apr 4, 2017·1 cites·30 claims
- 2042US5085084AMethod and apparatus for testing lead bonds and detecting failureHARRIS CORP·Filed 1990·Granted Feb 4, 1992·12 cites·26 claims
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