Assignee
HESTIA TECHNOLOGIES INC
US·17 granted patents·1 pending application·1,052 citations·filing 1995–2008
Top patents by PatentIndex Score
18 records- 0195US6038136AChip package with molded underfillHESTIA TECHNOLOGIES INC·Filed 1997·Granted Mar 14, 2000·219 cites·12 claims
- 0295US5798014AMethods of making multi-tier laminate substrates for electronic device packagingHESTIA TECHNOLOGIES INC·Filed 1996·Granted Aug 25, 1998·183 cites·15 claims
- 0390US6324069B1Chip package with molded underfillHESTIA TECHNOLOGIES INC·Filed 1999·Granted Nov 27, 2001·95 cites·15 claims
- 0490US5609889AApparatus for encapsulating electronic packagesHESTIA TECHNOLOGIES INC·Filed 1995·Granted Mar 11, 1997·98 cites·4 claims
- 0589US6560122B2Chip package with molded underfillHESTIA TECHNOLOGIES INC·Filed 2001·Granted May 6, 2003·47 cites·13 claims
- 0688US7049166B2Methods and apparatus for making integrated circuit package including opening exposing portion of the ICHESTIA TECHNOLOGIES INC·Filed 2001·Granted May 23, 2006·51 cites·29 claims
- 0786US5622588AMethods of making multi-tier laminate substrates for electronic device packagingHESTIA TECHNOLOGIES INC·Filed 1995·Granted Apr 22, 1997·75 cites·15 claims
- 0877US5776512AApparatus for encapsulating electronic packagesHESTIA TECHNOLOGIES INC·Filed 1996·Granted Jul 7, 1998·45 cites·6 claims
- 0976US5652463ATransfer modlded electronic package having a passage meansHESTIA TECHNOLOGIES INC·Filed 1995·Granted Jul 29, 1997·48 cites·22 claims
- 1073US5597643AMulti-tier laminate substrate with internal heat spreaderHESTIA TECHNOLOGIES INC·Filed 1995·Granted Jan 28, 1997·40 cites·9 claims
- 1172US6128195ATransfer molded PCMCIA standard cardsHESTIA TECHNOLOGIES INC·Filed 1997·Granted Oct 3, 2000·37 cites·6 claims
- 1265US5728248AMethod for making a multi-tier laminate substrate with internal heat spreaderHESTIA TECHNOLOGIES INC·Filed 1996·Granted Mar 17, 1998·28 cites·20 claims
- 1362US5689137AMethod for transfer molding standard electronic packages and apparatus formed therebyHESTIA TECHNOLOGIES INC·Filed 1995·Granted Nov 18, 1997·23 cites·21 claims
- 1459US6495083B2Method of underfilling an integrated circuit chipHESTIA TECHNOLOGIES INC·Filed 1999·Granted Dec 17, 2002·20 cites·14 claims
- 1558US5929522ASemiconductor non-laminate package and methodHESTIA TECHNOLOGIES INC·Filed 1998·Granted Jul 27, 1999·19 cites·11 claims
- 1653US2010014234A1Light-Emitting Pixel Array Package And Method of Manufacturing The SameHESTIA TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 1748US5766986AMethod of transfer molding electronic packages and packages produced therebyHESTIA TECHNOLOGIES INC·Filed 1996·Granted Jun 16, 1998·14 cites·12 claims
- 1845US6316291B1Method of fabricating a non-laminate carrier substrate utilizing a moldHESTIA TECHNOLOGIES INC·Filed 1999·Granted Nov 13, 2001·10 cites·7 claims
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