Inventor · disambiguated record
Kazuki Kawakubo
Also filed as: KAWAKUBO KAZUKI
6 granted patents·5 pending applications·14 citations·filing 2005–2016
77Inventor score
Top patents by PatentIndex Score
11 records- 0175US7811491B2Method for manufacturing optical electronic componentTOWA CORP·Filed 2005·Granted Oct 12, 2010·6 cites·4 claims
- 0268US8696951B2Manufacturing method of optical electronic components and optical electronic components manufactured using the sameTAKASE SHINJI·Filed 2007·Granted Apr 15, 2014·4 cites·10 claims
- 0363US7985357B2Method of resin-sealing and molding an optical deviceTOWA CORP·Filed 2006·Granted Jul 26, 2011·2 cites·6 claims
- 0461US8193558B2Optical electronic componentTAKASE SHINJI·Filed 2008·Granted Jun 5, 2012·2 cites·2 claims
- 0547US8771563B2Manufacturing method of optical electronic components and optical electronic components manufactured using the sameTAKASE SHINJI·Filed 2007·Granted Jul 8, 2014·0 cites·10 claims
- 0646US2007110839A1Resin-sealing and molding apparatus of optical deviceTAKASE SHINJI·Filed 2007·Application pending·0 cites
- 0743US2010006215A1Method of forming light emitter and molding dieTOWA CORP·Filed 2007·Application pending·0 cites
- 0841US2009114937A1Resin-sealed light emitting device and its manufacturing methodKAWAKUBO KAZUKI·Filed 2008·Application pending·0 cites
- 0941US2010065983A1Method of compression-molding light-emitting elementsTOWA CORP·Filed 2008·Application pending·0 cites
- 1037US2009091048A1Method of Sealing and Molding an Optical Device With ResinKAWAKUBO KAZUKI·Filed 2006·Application pending·0 cites
- 1132US10814532B2Resin-molding device and method for producing resin-molded productTOWA CORP·Filed 2016·Granted Oct 27, 2020·0 cites·8 claims
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