Inventor · disambiguated record
Anna M. Prakash
Also filed as: PRAKASH ANNA · PRAKASH ANNA M
19 granted patents·16 pending applications·98 citations·filing 2001–2021
92Inventor score
Files withINTEL CORP27PRAKASH ANNA M2ARIZONA BOARD OF RRGENTS ACTIN1DE BONIS THOMAS J1MASSON JEAN-FRANCOIS1
Top patents by PatentIndex Score
35 records- 0192US7332807B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2005·Granted Feb 19, 2008·26 cites·19 claims
- 0291US9685413B1Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2016·Granted Jun 20, 2017·12 cites·16 claims
- 0390US6717561B1Driving a liquid crystal displayTHREE FIVE SYSTEMS INC·Filed 2001·Granted Apr 6, 2004·47 cites·7 claims
- 0480US10168357B2Coated probe tips for plunger pins of an integrated circuit package test systemINTEL CORP·Filed 2015·Granted Jan 1, 2019·2 cites·2 claims
- 0578US9953929B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2016·Granted Apr 24, 2018·2 cites·7 claims
- 0674US9991211B2Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2017·Granted Jun 5, 2018·2 cites·14 claims
- 0768US7651020B2Amphiphilic block copolymers for improved flux applicationINTEL CORP·Filed 2007·Granted Jan 26, 2010·1 cites·14 claims
- 0867US7776657B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2007·Granted Aug 17, 2010·3 cites·10 claims
- 0965US9631065B2Methods of forming wafer level underfill materials and structures formed therebyINTEL CORP·Filed 2013·Granted Apr 25, 2017·1 cites·42 claims
- 1062US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 1158US10615128B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2018·Granted Apr 7, 2020·0 cites·17 claims
- 1255US11579426B2Dual collimating lens configuration for optical devicesINTEL CORP·Filed 2017·Granted Feb 14, 2023·0 cites·19 claims
- 1352US10315200B2Apparatus and system for storing and transporting magnetic devicesINTEL CORP·Filed 2017·Granted Jun 11, 2019·0 cites·31 claims
- 1452US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
- 1552US9704811B1Perforated conductive material for EMI shielding of semiconductor device and componentsINTEL CORP·Filed 2015·Granted Jul 11, 2017·0 cites·20 claims
- 1651US11022792B2Coupling a magnet with a MEMS deviceINTEL CORP·Filed 2016·Granted Jun 1, 2021·0 cites·20 claims
- 1750US7843075B2Apparatus and methods of forming an interconnect between a workpiece and substrateINTEL CORP·Filed 2008·Granted Nov 30, 2010·0 cites·20 claims
- 1850US2017250145A1Perforated conductive material for emi shielding of semiconductor device and componentsINTEL CORP·Filed 2017·Application pending·0 cites
- 1949US11156815B2Compound parabolic concentrator including protrusionINTEL CORP·Filed 2016·Granted Oct 26, 2021·0 cites·18 claims
- 2048US2008156852A1Solder flux composition and process of using samePRAKASH ANNA M·Filed 2006·Application pending·0 cites
- 2147US8183697B2Apparatus and methods of forming an interconnect between a workpiece and substrateSUPRIYA LAKSHMI·Filed 2010·Granted May 22, 2012·0 cites·19 claims
- 2247US2023049007A1Structures for micro led laser releaseINTEL CORP·Filed 2021·Application pending·0 cites
- 2346US2018342463A1Conductive adhesive layer for semiconductor devices and packagesINTEL CORP·Filed 2018·Application pending·0 cites
- 2446US2007031292A1Chemical sensors featuring dual-sensing motifsARIZONA BOARD OF RRGENTS ACTIN·Filed 2004·Application pending·0 cites
- 2545US2023084375A1Selective protection of integrated circuit chip surface regions from underfill contactINTEL CORP·Filed 2021·Application pending·0 cites
- 2644US2007286546A1Surface Initiated Thin Polymeric Films for Chemical SensorsMASSON JEAN-FRANCOIS·Filed 2004·Application pending·0 cites
- 2744US2007284412A1Solder flux compositionPRAKASH ANNA M·Filed 2006·Application pending·0 cites
- 2843US2018190593A1Conductive adhesive layer for semiconductor devices and packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 2943US2022416503A1Multiple metal layers within a photonics integrated circuit for thermal transferINTEL CORP·Filed 2021·Application pending·0 cites
- 3043US2018364438A1Flat non-optical surface of an optical componentINTEL CORP·Filed 2017·Application pending·0 cites
- 3140US2007152325A1Chip package dielectric sheet for body-biasingINTEL CORP·Filed 2005·Application pending·0 cites
- 3240US2017266948A1Modular squeegee head apparatus for printing materialsINTEL CORP·Filed 2016·Application pending·0 cites
- 3335US2008239660A1Flux precoated solder preform for thermal interface materialMUSTAPHA LATEEF·Filed 2007·Application pending·0 cites
- 3433US2019002735A1Coupling optoelectronic components using templated pressure sensitive adhesive filmsINTEL CORP·Filed 2017·Application pending·0 cites
- 3532US2018235075A1Shielding for semiconductor optoelectronic devices and packagesINTEL CORP·Filed 2017·Application pending·0 cites
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