Inventor · disambiguated record
Akio Bando
Also filed as: BANDO AKIO
4 granted patents·202 citations·filing 1989–1998
81Inventor score
Files withSHINKAWA KK4
Top patents by PatentIndex Score
4 records- 0185US5953624ABump forming methodSHINKAWA KK·Filed 1998·Granted Sep 14, 1999·116 cites·2 claims
- 0262US5156318AUltrasonic bonding apparatus for bonding a semiconductor device to a tab tapeSHINKAWA KK·Filed 1991·Granted Oct 20, 1992·35 cites·3 claims
- 0359US4887758AApparatus for connecting external leadsSHINKAWA KK·Filed 1989·Granted Dec 19, 1989·25 cites·3 claims
- 0457US5205460ABonding apparatusSHINKAWA KK·Filed 1992·Granted Apr 27, 1993·26 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →