Inventor · disambiguated record
Chih-Feng Fan
Also filed as: FAN CHIH-FENG
5 granted patents·3 pending applications·14 citations·filing 2005–2022
73Inventor score
Top patents by PatentIndex Score
8 records- 0186US11562948B2Semiconductor package having step cut sawn into molding compound along perimeter of the semiconductor packageMEDIATEK INC·Filed 2020·Granted Jan 24, 2023·2 cites·10 claims
- 0281US9423187B2Plate type heat pipe with mesh wick structure having openingFOXCONN TECH CO LTD·Filed 2012·Granted Aug 23, 2016·4 cites·18 claims
- 0372US7743818B2Heat exchange moduleFOXCONN TECH CO LTD·Filed 2006·Granted Jun 29, 2010·6 cites·19 claims
- 0467US12205869B2Method for forming a semiconductor packageMEDIATEK INC·Filed 2022·Granted Jan 21, 2025·0 cites·6 claims
- 0564US7530385B2Rotary-type total heat exchangerFOXCONN TECH CO LTD·Filed 2005·Granted May 12, 2009·2 cites·20 claims
- 0654US2016320143A1Plate type heat pipe with mesh wick structure having openingFOXCONN TECH CO LTD·Filed 2016·Application pending·0 cites
- 0753US2007006994A1Loop-type heat exchange deviceLIU TAY-JIAN·Filed 2005·Application pending·0 cites
- 0850US2022319970A1Semiconductor packageMEDIATEK INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →