Inventor · disambiguated record
Jin Gu Kim
Also filed as: KIM JIN GU
36 granted patents·24 pending applications·309 citations·filing 1997–2025
97Inventor score
Files withSAMSUNG ELECTRO MECH27SAMSUNG ELECTRONICS CO LTD6KIM JIN GU4HYNIX SEMICONDUCTOR INC3HYUNDAI ELECTRONICS IND3
Top patents by PatentIndex Score
60 records- 0192US10748856B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·8 cites·16 claims
- 0292US8830689B2Interposer-embedded printed circuit boardKIM JIN GU·Filed 2011·Granted Sep 9, 2014·19 cites·7 claims
- 0390US10043772B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 7, 2018·7 cites·21 claims
- 0489US9264010B2Via structure having open stub and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 16, 2016·9 cites·12 claims
- 0589US5949496AColor correction device for correcting color distortion and gamma characteristicSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Sep 7, 1999·124 cites·6 claims
- 0683US8704350B2Stacked wafer level package and method of manufacturing the samePARK SEUNG WOOK·Filed 2009·Granted Apr 22, 2014·11 cites·5 claims
- 0783US8658467B2Method of manufacturing stacked wafer level packagePARK SEUNG WOOK·Filed 2011·Granted Feb 25, 2014·7 cites·8 claims
- 0881US8502295B2Nonvolatile memory deviceKIM JIN GU·Filed 2011·Granted Aug 6, 2013·5 cites·10 claims
- 0980US10312195B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 4, 2019·3 cites·20 claims
- 1080US8064215B2Semiconductor chip package and printed circuit boardCHUNG YUL-KYO·Filed 2008·Granted Nov 22, 2011·11 cites·4 claims
- 1180US6363004B1Nonvolatile ferroelectric memory having shunt linesHYUNDAI ELECTRONICS IND·Filed 2000·Granted Mar 26, 2002·25 cites·18 claims
- 1278US8143099B2Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layerPARK SEUNG WOOK·Filed 2009·Granted Mar 27, 2012·8 cites·12 claims
- 1377US9173291B2Circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 27, 2015·3 cites·31 claims
- 1476US7617540B2Method for managing download of duplicate contentsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 10, 2009·7 cites·14 claims
- 1574US7947530B2Method of manufacturing wafer level package including coating and removing resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2009·Granted May 24, 2011·5 cites·6 claims
- 1674US7832673B2Fly reelJUHO CORP·Filed 2006·Granted Nov 16, 2010·6 cites·6 claims
- 1773US9082488B2Flash memory device and method of programming the sameSK HYNIX INC·Filed 2012·Granted Jul 14, 2015·5 cites·18 claims
- 1873US8026590B2Die package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Sep 27, 2011·5 cites·16 claims
- 1968US9629260B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 18, 2017·1 cites·8 claims
- 2068US6482658B2Nonvolatile ferroelectric memory having shunt linesHYUNDAI ELECTRONICS IND·Filed 2002·Granted Nov 19, 2002·14 cites·16 claims
- 2161US11515265B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·16 claims
- 2260US8373537B2Resistor having parallel structure and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2010·Granted Feb 12, 2013·1 cites·17 claims
- 2359US2025340716A1Polymer composite emitting near infrared ray and near infrared emitting commodities comprising the sameKYUNGPOOK NAT UNIV IND ACADEMIC COOP FOUND·Filed 2025·Application pending·0 cites
- 2458US6320783B1Nonvolatile ferroelectric memory device and circuit for driving the sameHYUNDAI ELECTRONICS IND·Filed 2000·Granted Nov 20, 2001·10 cites·23 claims
- 2557US11670623B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·22 claims
- 2656US9093736B2Common mode filter and method for manufacturing the sameKIM JIN GU·Filed 2012·Granted Jul 28, 2015·1 cites·11 claims
- 2756US9035196B2Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 19, 2015·0 cites·6 claims
- 2855US2021262121A1Method of mxene fiber and mxene fiber manufactured therefromKOREA ADVANCED INST SCI & TECH·Filed 2021·Application pending·0 cites
- 2953US9253873B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 2, 2016·0 cites·12 claims
- 3053US8093124B2Method of manufacturing nonvolatile memory deviceLEE MYUNG SHIK·Filed 2010·Granted Jan 10, 2012·1 cites·20 claims
- 3152US8030203B2Method of forming metal line of semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Oct 4, 2011·0 cites·6 claims
- 3250US8685852B2Method of forming metal line of semiconductor deviceKIM JIN GU·Filed 2011·Granted Apr 1, 2014·0 cites·13 claims
- 3350US2015041180A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3449US2015000958A1Printed circuit board and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3548US12389892B2Drag device for fishing reel using fluid resistanceJUHO LEPORTS CORP·Filed 2021·Granted Aug 19, 2025·0 cites·8 claims
- 3648US2013168132A1Printed circuit board and method of manufacturing the sameSUMSUNG ELECTRO MECHANICS CO LTD·Filed 2012·Application pending·0 cites
- 3748US2015156887A1Method of forming amorphous alloy film and printed wiring board manufactured by the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3848US2014166347A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3947US2014176278A1Inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4047US2010149770A1Semiconductor stack packageSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 4146US8624128B2Printed circuit board and manufacturing method thereofHONG JU-PYO·Filed 2011·Granted Jan 7, 2014·0 cites·8 claims
- 4246US2011201156A1Method of manufacturing wafer level package including coating resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 4345US2013149437A1Method for manufacturing printed circuit boardOH KYUNG SEOB·Filed 2012·Application pending·0 cites
- 4445US2013153266A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4544US6016168AColor correction deviceSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jan 18, 2000·10 cites·9 claims
- 4644US2014182905A1Printed circuit board and surface treatment method of printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4743US10315577B2Side mirror for vehicleBULLSONE CO LTD·Filed 2014·Granted Jun 11, 2019·0 cites·1 claims
- 4843US2013153275A1Printed circuit board and method for manufacturing the sameHYUN JIN GUL·Filed 2012·Application pending·0 cites
- 4942US6919212B2Method for fabricating ferroelectric random access memory device with merged-top electrode-plateline capacitorHYNIX SEMICONDUCTOR INC·Filed 2003·Granted Jul 19, 2005·2 cites·7 claims
- 5041US2014104798A1Hybrid lamination substrate, manufacturing method thereof and package substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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