Inventor · disambiguated record
Richard C. Stamey
Also filed as: STAMEY RICHARD · STAMEY RICHARD C · STAMEY RICHARD CHRISTOPHER
11 granted patents·2 pending applications·44 citations·filing 2005–2022
85Inventor score
Top patents by PatentIndex Score
13 records- 0193US11923257B2Hybrid microelectronic substratesINTEL CORP·Filed 2021·Granted Mar 5, 2024·2 cites·18 claims
- 0293US9516792B2Ultrasound assisted immersion coolingINTEL CORP·Filed 2015·Granted Dec 6, 2016·23 cites·13 claims
- 0383US7555228B2Method and system for facilitating burst-mode optical power measurementALCATEL LUCENT·Filed 2005·Granted Jun 30, 2009·15 cites·13 claims
- 0474US11114353B2Hybrid microelectronic substratesINTEL CORP·Filed 2016·Granted Sep 7, 2021·2 cites·20 claims
- 0567US11929295B2Multi-use package architectureINTEL CORP·Filed 2022·Granted Mar 12, 2024·0 cites·14 claims
- 0659US11444033B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2020·Granted Sep 13, 2022·0 cites·19 claims
- 0756US9304561B2Power management in a circuitINTEL CORP·Filed 2013·Granted Apr 5, 2016·2 cites·20 claims
- 0853US9829915B2Modular printed circuit boardINTEL CORP·Filed 2014·Granted Nov 28, 2017·0 cites·14 claims
- 0949US2019287872A1Multi-use package architectureINTEL CORP·Filed 2018·Application pending·0 cites
- 1047US10763215B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2015·Granted Sep 1, 2020·0 cites·7 claims
- 1144US2017071079A1Ultrasound assisted immersion coolingINTEL CORP·Filed 2016·Application pending·0 cites
- 1238US9900983B2Modular printed circuit board electrical integrity and usesINTEL CORP·Filed 2016·Granted Feb 20, 2018·0 cites·35 claims
- 1335US10716214B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2015·Granted Jul 14, 2020·0 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →