Inventor · disambiguated record
Akihiro Dohya
Also filed as: DOHYA AKIHIRO
11 granted patents·564 citations·filing 1982–2005
93Inventor score
Top patents by PatentIndex Score
11 records- 0194US6188127B1Semiconductor packing stack module and method of producing the sameNEC CORP·Filed 1996·Granted Feb 13, 2001·226 cites·12 claims
- 0290US4736521AProcess for manufacturing a ceramic multi-layer substrateNEC CORP·Filed 1987·Granted Apr 12, 1988·80 cites·8 claims
- 0384US5777847AMultichip module having a cover wtih support pillarNEC CORP·Filed 1997·Granted Jul 7, 1998·81 cites·49 claims
- 0482US4665468AModule having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the sameNEC CORP·Filed 1985·Granted May 12, 1987·54 cites·3 claims
- 0574US4434544AMultilayer circuit and process for manufacturing the sameNIPPON ELECTRIC CO·Filed 1982·Granted Mar 6, 1984·27 cites·10 claims
- 0671US5012047AMultilayer wiring substrateNEC CORP·Filed 1990·Granted Apr 30, 1991·44 cites·14 claims
- 0767US7297575B2System semiconductor device and method of manufacturing the sameNEC CORP·Filed 2005·Granted Nov 20, 2007·3 cites·15 claims
- 0855US5767689ABare chip test carrier with an improved holding structure for a semiconductor chipNEC CORP·Filed 1995·Granted Jun 16, 1998·19 cites·5 claims
- 0952US7098538B1System semiconductor device and method of manufacturing the sameNEC CORP·Filed 2000·Granted Aug 29, 2006·4 cites·6 claims
- 1051US4786523ASubstrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metalsNIPPON ELECTRIC CO·Filed 1986·Granted Nov 22, 1988·15 cites·10 claims
- 1148US4628149ASubstrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metalsNIPPON ELECTRIC CO·Filed 1982·Granted Dec 9, 1986·11 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →