Inventor · disambiguated record
Kenichi Tokuno
Also filed as: TOKUNO KENICHI
10 granted patents·1,024 citations·filing 1994–1997
93Inventor score
Files withNEC CORP10
Top patents by PatentIndex Score
10 records- 0194US6188127B1Semiconductor packing stack module and method of producing the sameNEC CORP·Filed 1996·Granted Feb 13, 2001·226 cites·12 claims
- 0293US5883426AStack moduleNEC CORP·Filed 1997·Granted Mar 16, 1999·410 cites·7 claims
- 0388US5869886AFlip chip semiconductor mounting structure with electrically conductive resinNEC CORP·Filed 1997·Granted Feb 9, 1999·111 cites·22 claims
- 0484US5777847AMultichip module having a cover wtih support pillarNEC CORP·Filed 1997·Granted Jul 7, 1998·81 cites·49 claims
- 0581US5892289ABare chip mounting structure and manufacturing method thereforNEC CORP·Filed 1997·Granted Apr 6, 1999·67 cites·16 claims
- 0673US6094354AChip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting boardNEC CORP·Filed 1997·Granted Jul 25, 2000·43 cites·16 claims
- 0766US5686763ADevice module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristicsNEC CORP·Filed 1995·Granted Nov 11, 1997·29 cites·18 claims
- 0859US5565704AMemory card having two types of memory integrated circuits connected to two different shaped connectorsNEC CORP·Filed 1994·Granted Oct 15, 1996·27 cites·19 claims
- 0955US5767689ABare chip test carrier with an improved holding structure for a semiconductor chipNEC CORP·Filed 1995·Granted Jun 16, 1998·19 cites·5 claims
- 1045US5763295ADevice module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristicsNEC CORP·Filed 1997·Granted Jun 9, 1998·11 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →