Inventor · disambiguated record
Harry Fuerhaupter
Also filed as: FUERHAUPTER HARRY
7 granted patents·1 pending application·391 citations·filing 1991–2003
88Inventor score
Top patents by PatentIndex Score
8 records- 0192US5895229AMicroelectronic package including a polymer encapsulated die, and method for forming sameMOTOROLA INC·Filed 1997·Granted Apr 20, 1999·128 cites·11 claims
- 0292US5320272ATin-bismuth solder connection having improved high temperature properties, and process for forming sameMOTOROLA INC·Filed 1993·Granted Jun 14, 1994·95 cites·17 claims
- 0391US6093972AMicroelectronic package including a polymer encapsulated dieMOTOROLA INC·Filed 1999·Granted Jul 25, 2000·125 cites·5 claims
- 0465US5435838AImmersion plating of tin-bismuth solderMOTOROLA INC·Filed 1994·Granted Jul 25, 1995·22 cites·6 claims
- 0556US7153449B2Acidic treatment liquid and method of treating copper surfacesATOTECH DEUTSCHLAND GMBH·Filed 2001·Granted Dec 26, 2006·5 cites·11 claims
- 0647US5183692APolyimide coating having electroless metal plateMOTOROLA INC·Filed 1991·Granted Feb 2, 1993·15 cites·4 claims
- 0736US2005067378A1Method for micro-roughening treatment of copper and mixed-metal circuitryFiled 2003·Application pending·0 cites
- 0827US5391402AImmersion plating of tin-bismuth solderMOTOROLA INC·Filed 1993·Granted Feb 21, 1995·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →