Inventor · disambiguated record
Maria Clemens Y. Quinones
Also filed as: QUINONES MARIA C Y · QUINONES MARIA CLEMENS · QUINONES MARIA CLEMENS Y · QUINONES MARIA CLEMENS YPIL
21 granted patents·5 pending applications·696 citations·filing 2000–2025
95Inventor score
Files withFAIRCHILD SEMICONDUCTOR13SEMICONDUCTOR COMPONENTS IND LLC8QUINONES MARIA CLEMENS Y2MADRID RUBEN1MADRID RUBEN P1
Top patents by PatentIndex Score
26 records- 0198US6777800B2Semiconductor die package including drain clipFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Aug 17, 2004·264 cites·14 claims
- 0295US7196313B2Surface mount multi-channel optocouplerFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted Mar 27, 2007·108 cites·27 claims
- 0394US6989588B2Semiconductor device including molded wireless exposed drain packagingFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted Jan 24, 2006·102 cites·13 claims
- 0493US11791247B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Oct 17, 2023·2 cites·20 claims
- 0592US9735112B2Isolation between semiconductor componentsFAIRCHILD SEMICONDUCTOR·Filed 2015·Granted Aug 15, 2017·13 cites·20 claims
- 0689US6870254B1Flip clip attach and copper clip attach on MOSFET deviceFAIRCHILD SEMICONDUCTOR·Filed 2000·Granted Mar 22, 2005·50 cites·8 claims
- 0789US6762067B1Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by railsFAIRCHILD SEMICONDUCTOR·Filed 2000·Granted Jul 13, 2004·115 cites·27 claims
- 0887US7052938B2Flip clip attach and copper clip attach on MOSFET deviceFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted May 30, 2006·14 cites·8 claims
- 0982US8106501B2Semiconductor die package including low stress configurationQUINONES MARIA CLEMENS Y·Filed 2008·Granted Jan 31, 2012·10 cites·11 claims
- 1080US10446498B2Isolation between semiconductor componentsFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Oct 15, 2019·3 cites·18 claims
- 1176US12300583B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1275US2024429136A1Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1374US7659531B2Optical coupler packageFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Feb 9, 2010·8 cites·24 claims
- 1474US2025233055A1Electronic device packaging with galvanic isolationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1570US7626249B2Flex clip connector for semiconductor deviceFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Dec 1, 2009·4 cites·20 claims
- 1667US7893548B2SiP substrateFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Feb 22, 2011·3 cites·12 claims
- 1765US12278169B2Electronic device packaging with galvanic isolationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 15, 2025·0 cites·20 claims
- 1861US12087677B2Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 10, 2024·0 cites·13 claims
- 1954US10943855B2Electronic device packaging with galvanic isolationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 9, 2021·0 cites·13 claims
- 2052US11616006B2Semiconductor package with heatsinkSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 28, 2023·0 cites·18 claims
- 2152US7824966B2Flex chip connector for semiconductor deviceFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Nov 2, 2010·0 cites·20 claims
- 2251US2010164078A1Package assembly for semiconductor devicesMADRID RUBEN·Filed 2008·Application pending·0 cites
- 2349US9583454B2Semiconductor die package including low stress configurationQUINONES MARIA CLEMENS Y·Filed 2011·Granted Feb 28, 2017·0 cites·20 claims
- 2447US8372690B2SiP substrateFAIRCHILD SEMICONDUCTOR·Filed 2011·Granted Feb 12, 2013·0 cites·12 claims
- 2545US2011244633A1Package assembly for semiconductor devicesMADRID RUBEN P·Filed 2011·Application pending·0 cites
- 2642US2009057855A1Semiconductor die package including stand off structuresQUINONES MARIA CLEMENS·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →