Inventor · disambiguated record
Sunyoung Chun
Also filed as: CHUN SUNYOUNG
5 granted patents·52 citations·filing 2008–2013
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0193US8004093B2Integrated circuit package stacking systemSTATS CHIPPAC LTD·Filed 2008·Granted Aug 23, 2011·37 cites·18 claims
- 0281US8932908B2Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Jan 13, 2015·5 cites·30 claims
- 0379US8432028B2Integrated circuit packaging system with package-on-package and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Apr 30, 2013·8 cites·20 claims
- 0464US8288202B2Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor dieLEE KYUWON·Filed 2010·Granted Oct 16, 2012·2 cites·20 claims
- 0547US8502392B2Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor dieLEE KYUWON·Filed 2012·Granted Aug 6, 2013·0 cites·25 claims
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