Inventor · disambiguated record
Seng Guan Chow
Also filed as: CHOW SENG GUAN
207 granted patents·9 pending applications·4,187 citations·filing 2001–2020
99Inventor score
Files withSTATS CHIPPAC LTD101CHOW SENG GUAN30SHIM IL KWON15HUANG RUI14ST ASSEMBLY TEST SERVICES LTD11
Top patents by PatentIndex Score
216 records- 0199US8354297B2Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor dieSTATS CHIPPAC LTD·Filed 2010·Granted Jan 15, 2013·125 cites·25 claims
- 0299US8039303B2Method of forming stress relief layer between die and interconnect structureSTATS CHIPPAC LTD·Filed 2009·Granted Oct 18, 2011·110 cites·25 claims
- 0399US7364945B2Method of mounting an integrated circuit package in an encapsulant cavitySTATS CHIPPAC LTD·Filed 2006·Granted Apr 29, 2008·100 cites·13 claims
- 0499US6861288B2Stacked semiconductor packages and method for the fabrication thereofST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Mar 1, 2005·308 cites·8 claims
- 0598US9893045B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2015·Granted Feb 13, 2018·33 cites·19 claims
- 0698US9524955B2Semiconductor device and method of forming no-flow underfill material around vertical interconnect structureHUANG RUI·Filed 2012·Granted Dec 20, 2016·49 cites·5 claims
- 0798US9059186B2Embedded semiconductor die package and method of making the same using metal frame carrierSTATS CHIPPAC LTD·Filed 2014·Granted Jun 16, 2015·41 cites·25 claims
- 0898US8354304B2Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Jan 15, 2013·69 cites·25 claims
- 0998US7923295B2Semiconductor device and method of forming the device using sacrificial carrierSTATS CHIPPAC LTD·Filed 2009·Granted Apr 12, 2011·55 cites·14 claims
- 1098US7902644B2Integrated circuit package system for electromagnetic isolationSTATS CHIPPAC LTD·Filed 2007·Granted Mar 8, 2011·95 cites·18 claims
- 1198US7553752B2Method of making a wafer level integration packageSTATS CHIPPAC LTD·Filed 2007·Granted Jun 30, 2009·79 cites·17 claims
- 1298US7435619B2Method of fabricating a 3-D package stacking systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 14, 2008·75 cites·20 claims
- 1398US7429787B2Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted Sep 30, 2008·88 cites·17 claims
- 1498US7372141B2Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted May 13, 2008·109 cites·24 claims
- 1597US8896109B2Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Nov 25, 2014·39 cites·24 claims
- 1697US8685792B2Integrated circuit package system with interposerCHOW SENG GUAN·Filed 2008·Granted Apr 1, 2014·52 cites·10 claims
- 1797US8354746B2Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulantSTATS CHIPPAC LTD·Filed 2011·Granted Jan 15, 2013·34 cites·26 claims
- 1897US8309397B2Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereofSHIM IL KWON·Filed 2011·Granted Nov 13, 2012·26 cites·10 claims
- 1997US8278141B2Integrated circuit package system with internal stacking moduleCHOW SENG GUAN·Filed 2008·Granted Oct 2, 2012·54 cites·19 claims
- 2097US8258015B2Integrated circuit package system with penetrable film adhesiveCHOW SENG GUAN·Filed 2008·Granted Sep 4, 2012·55 cites·24 claims
- 2197US8072059B2Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor dieSHIM IL KWON·Filed 2009·Granted Dec 6, 2011·54 cites·25 claims
- 2297US8004095B2Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerSTATS CHIPPAC LTD·Filed 2010·Granted Aug 23, 2011·50 cites·25 claims
- 2397US7989270B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsSTATS CHIPPAC LTD·Filed 2009·Granted Aug 2, 2011·45 cites·24 claims
- 2497US7842542B2Embedded semiconductor die package and method of making the same using metal frame carrierSTATS CHIPPAC LTD·Filed 2008·Granted Nov 30, 2010·36 cites·33 claims
- 2597US7767496B2Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerSTATS CHIPPAC LTD·Filed 2007·Granted Aug 3, 2010·46 cites·19 claims
- 2697US7598606B2Integrated circuit package system with die and package combinationSTATS CHIPPAC LTD·Filed 2005·Granted Oct 6, 2009·87 cites·13 claims
- 2797US7399658B2Pre-molded leadframe and method thereforSTATS CHIPPAC LTD·Filed 2006·Granted Jul 15, 2008·80 cites·20 claims
- 2896US8390108B2Integrated circuit packaging system with stacking interconnect and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Mar 5, 2013·47 cites·19 claims
- 2996US8383457B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2010·Granted Feb 26, 2013·22 cites·20 claims
- 3096US8106500B2Stackable integrated circuit package systemCHOW SENG GUAN·Filed 2010·Granted Jan 31, 2012·28 cites·10 claims
- 3196US7795078B2Leadframe package for MEMS microphone assemblySTATS CHIPPAC LTD·Filed 2009·Granted Sep 14, 2010·40 cites·19 claims
- 3296US7786008B2Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 31, 2010·45 cites·20 claims
- 3396US7723159B2Package-on-package using through-hole via die on saw streetsSTATS CHIPPAC LTD·Filed 2007·Granted May 25, 2010·44 cites·19 claims
- 3496US7309913B2Stacked semiconductor packagesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 18, 2007·94 cites·8 claims
- 3596US6599779B2PBGA substrate for anchoring heat sinkST ASSEMBLY TEST SERVICE LTD·Filed 2001·Granted Jul 29, 2003·130 cites·11 claims
- 3695US8476120B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsHUANG RUI·Filed 2012·Granted Jul 2, 2013·16 cites·35 claims
- 3795US8034661B2Semiconductor device and method of forming compliant stress relief buffer around large array WLCSPSTATS CHIPPAC LTD·Filed 2009·Granted Oct 11, 2011·21 cites·24 claims
- 3895US7550828B2Leadframe package for MEMS microphone assemblySTATS CHIPPAC INC·Filed 2007·Granted Jun 23, 2009·30 cites·19 claims
- 3995US7005325B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·99 cites·10 claims
- 4094US9252172B2Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity regionCHOW SENG GUAN·Filed 2011·Granted Feb 2, 2016·34 cites·18 claims
- 4194US8846454B2Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerSHIM IL KWON·Filed 2012·Granted Sep 30, 2014·13 cites·28 claims
- 4294US8643163B2Integrated circuit package-on-package stacking system and method of manufacture thereofSHIM IL KWON·Filed 2009·Granted Feb 4, 2014·35 cites·20 claims
- 4394US8456002B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefLIN YAOJIAN·Filed 2011·Granted Jun 4, 2013·13 cites·25 claims
- 4494US8304880B2Integrated circuit packaging system with package-on-package and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Nov 6, 2012·22 cites·20 claims
- 4594US7768125B2Multi-chip package systemSTATS CHIPPAC LTD·Filed 2006·Granted Aug 3, 2010·31 cites·20 claims
- 4694US7750452B2Same size die stacked package having through-hole vias formed in organic materialSTATS CHIPPAC LTD·Filed 2007·Granted Jul 6, 2010·25 cites·25 claims
- 4794US7535086B2Integrated circuit package-on-package stacking systemSTATS CHIPPAC LTD·Filed 2006·Granted May 19, 2009·34 cites·8 claims
- 4894US7385299B2Stackable integrated circuit package system with multiple interconnect interfaceSTATS CHIPPAC LTD·Filed 2006·Granted Jun 10, 2008·31 cites·17 claims
- 4994US6534859B1Semiconductor package having heat sink attached to pre-molded cavities and method for creating the packageST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Mar 18, 2003·118 cites·63 claims
- 5093US9240380B2Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectSTATS CHIPPAC LTD·Filed 2012·Granted Jan 19, 2016·11 cites·27 claims
Showing the top 50 of 216 patent records by PatentIndex Score.
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