Inventor · disambiguated record
Tsz Yin Ho
Also filed as: HO TSZ YIN
10 granted patents·158 citations·filing 2004–2011
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0195US7298038B2Integrated circuit package system including die stackingSTATS CHIPPAC LTD·Filed 2006·Granted Nov 20, 2007·39 cites·10 claims
- 0292US7622325B2Integrated circuit package system including high-density small footprint system-in-packageSTATS CHIPPAC LTD·Filed 2005·Granted Nov 24, 2009·25 cites·20 claims
- 0391US6943057B1Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2004·Granted Sep 13, 2005·68 cites·16 claims
- 0482US7986043B2Integrated circuit package on package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 26, 2011·11 cites·20 claims
- 0579US7619314B2Integrated circuit package system including die stackingSTATS CHIPPAC LTD·Filed 2007·Granted Nov 17, 2009·7 cites·8 claims
- 0674US7981702B2Integrated circuit package in package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 19, 2011·5 cites·10 claims
- 0762US8513542B2Integrated circuit leaded stacked package systemKUAN HEAP HOE·Filed 2006·Granted Aug 20, 2013·2 cites·13 claims
- 0853US8164172B2Integrated circuit package in package systemHO TSZ YIN·Filed 2011·Granted Apr 24, 2012·1 cites·10 claims
- 0952US7928564B2Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2008·Granted Apr 19, 2011·0 cites·9 claims
- 1047US7445955B2Multichip module package and fabrication methodSTATS CHIPPAC LTD·Filed 2005·Granted Nov 4, 2008·0 cites·10 claims
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