Inventor · disambiguated record
Heap Hoe Kuan
Also filed as: KUAN HEAP · KUAN HEAP HOE
143 granted patents·6 pending applications·1,881 citations·filing 2005–2016
99Inventor score
Top patents by PatentIndex Score
149 records- 0198US9524955B2Semiconductor device and method of forming no-flow underfill material around vertical interconnect structureHUANG RUI·Filed 2012·Granted Dec 20, 2016·49 cites·5 claims
- 0298US9059186B2Embedded semiconductor die package and method of making the same using metal frame carrierSTATS CHIPPAC LTD·Filed 2014·Granted Jun 16, 2015·41 cites·25 claims
- 0398US8354304B2Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Jan 15, 2013·69 cites·25 claims
- 0498US8263434B2Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoPPAGAILA REZA A·Filed 2009·Granted Sep 11, 2012·110 cites·20 claims
- 0598US7902644B2Integrated circuit package system for electromagnetic isolationSTATS CHIPPAC LTD·Filed 2007·Granted Mar 8, 2011·95 cites·18 claims
- 0698US7553752B2Method of making a wafer level integration packageSTATS CHIPPAC LTD·Filed 2007·Granted Jun 30, 2009·79 cites·17 claims
- 0797US8354746B2Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulantSTATS CHIPPAC LTD·Filed 2011·Granted Jan 15, 2013·34 cites·26 claims
- 0897US8278141B2Integrated circuit package system with internal stacking moduleCHOW SENG GUAN·Filed 2008·Granted Oct 2, 2012·54 cites·19 claims
- 0997US8258015B2Integrated circuit package system with penetrable film adhesiveCHOW SENG GUAN·Filed 2008·Granted Sep 4, 2012·55 cites·24 claims
- 1097US7989270B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsSTATS CHIPPAC LTD·Filed 2009·Granted Aug 2, 2011·45 cites·24 claims
- 1197US7842542B2Embedded semiconductor die package and method of making the same using metal frame carrierSTATS CHIPPAC LTD·Filed 2008·Granted Nov 30, 2010·36 cites·33 claims
- 1297US7585750B2Semiconductor package having through-hole via on saw streets formed with partial sawSTATS CHIPPAC LTD·Filed 2007·Granted Sep 8, 2009·48 cites·26 claims
- 1396US8390108B2Integrated circuit packaging system with stacking interconnect and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Mar 5, 2013·47 cites·19 claims
- 1496US8106500B2Stackable integrated circuit package systemCHOW SENG GUAN·Filed 2010·Granted Jan 31, 2012·28 cites·10 claims
- 1596US8101460B2Semiconductor device and method of shielding semiconductor die from inter-device interferencePAGAILA REZA A·Filed 2008·Granted Jan 24, 2012·44 cites·25 claims
- 1696US7829998B2Semiconductor wafer having through-hole vias on saw streets with backside redistribution layerSTATS CHIPPAC LTD·Filed 2007·Granted Nov 9, 2010·35 cites·25 claims
- 1796US7723159B2Package-on-package using through-hole via die on saw streetsSTATS CHIPPAC LTD·Filed 2007·Granted May 25, 2010·44 cites·19 claims
- 1896US7704796B2Semiconductor device and method of forming recessed conductive vias in saw streetsSTATS CHIPPAC LTD·Filed 2008·Granted Apr 27, 2010·40 cites·20 claims
- 1996US7659145B2Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the deviceSTATS CHIPPAC LTD·Filed 2008·Granted Feb 9, 2010·38 cites·20 claims
- 2096US7569421B2Through-hole via on saw streetsSTATS CHIPPAC LTD·Filed 2007·Granted Aug 4, 2009·43 cites·24 claims
- 2195US8476120B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsHUANG RUI·Filed 2012·Granted Jul 2, 2013·16 cites·35 claims
- 2294US8304880B2Integrated circuit packaging system with package-on-package and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Nov 6, 2012·22 cites·20 claims
- 2394US8247268B2Semiconductor wafer having through-hole vias on saw streets with backside redistribution layerDO BYUNG TAI·Filed 2010·Granted Aug 21, 2012·16 cites·34 claims
- 2494US7768125B2Multi-chip package systemSTATS CHIPPAC LTD·Filed 2006·Granted Aug 3, 2010·31 cites·20 claims
- 2594US7750452B2Same size die stacked package having through-hole vias formed in organic materialSTATS CHIPPAC LTD·Filed 2007·Granted Jul 6, 2010·25 cites·25 claims
- 2694US7535086B2Integrated circuit package-on-package stacking systemSTATS CHIPPAC LTD·Filed 2006·Granted May 19, 2009·34 cites·8 claims
- 2794US7385299B2Stackable integrated circuit package system with multiple interconnect interfaceSTATS CHIPPAC LTD·Filed 2006·Granted Jun 10, 2008·31 cites·17 claims
- 2893US8624364B2Integrated circuit packaging system with encapsulation connector and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Jan 7, 2014·17 cites·20 claims
- 2993US7843042B2Wafer level integration packageSTATS CHIPPAC LTD·Filed 2009·Granted Nov 30, 2010·22 cites·25 claims
- 3093US7723146B2Integrated circuit package system with image sensor systemSTATS CHIPPAC LTD·Filed 2006·Granted May 25, 2010·21 cites·10 claims
- 3192US8269320B2Integrated circuit package system for electromagnetic isolation and method for manufacturing thereofHUANG RUI·Filed 2011·Granted Sep 18, 2012·12 cites·18 claims
- 3292US7993941B2Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Aug 9, 2011·20 cites·27 claims
- 3392US7989269B2Semiconductor package with penetrable encapsulant joining semiconductor die and method thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 2, 2011·20 cites·25 claims
- 3492US7902638B2Semiconductor die with through-hole via on saw streets and through-hole via in active area of dieSTATS CHIPPAC LTD·Filed 2007·Granted Mar 8, 2011·20 cites·15 claims
- 3591US8716853B2Extended redistribution layers bumped waferDO BYUNG TAI·Filed 2010·Granted May 6, 2014·10 cites·28 claims
- 3691US7888184B2Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Feb 15, 2011·17 cites·10 claims
- 3790US8421197B2Integrated circuit package system with warp-free chipDO BYUNG TAI·Filed 2011·Granted Apr 16, 2013·9 cites·10 claims
- 3890US8178956B2Integrated circuit package system for shielding electromagnetic interferenceDO BYUNG TAI·Filed 2007·Granted May 15, 2012·19 cites·20 claims
- 3990US7923846B2Integrated circuit package-in-package system with wire-in-film encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Apr 12, 2011·13 cites·9 claims
- 4090US7566966B2Integrated circuit package-on-package system with anti-mold flash featureSTATS CHIPPAC LTD·Filed 2007·Granted Jul 28, 2009·18 cites·20 claims
- 4189US8957530B2Integrated circuit packaging system with embedded circuitry and postSHIM IL KWON·Filed 2011·Granted Feb 17, 2015·9 cites·10 claims
- 4289US8421202B2Integrated circuit packaging system with flex tape and method of manufacture thereofSHIM IL KWON·Filed 2010·Granted Apr 16, 2013·10 cites·20 claims
- 4388US8378502B2Integrated circuit package system with image sensor systemSTATS CHIPPAC LTD·Filed 2010·Granted Feb 19, 2013·7 cites·7 claims
- 4488US7993979B2Leadless package system having external contactsSTATS CHIPPAC LTD·Filed 2007·Granted Aug 9, 2011·13 cites·10 claims
- 4588US7709944B2Integrated circuit package system with package integrationSTATS CHIPPAC LTD·Filed 2007·Granted May 4, 2010·16 cites·22 claims
- 4687US9099455B2Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulantSTATS CHIPPAC LTD·Filed 2012·Granted Aug 4, 2015·7 cites·32 claims
- 4787US8405228B2Integrated circuit packaging system with package underfill and method of manufacture thereofHUANG RUI·Filed 2009·Granted Mar 26, 2013·13 cites·9 claims
- 4887US8222717B2Embedded semiconductor die package and method of making the same using metal frame carrierSHIM IL KWON·Filed 2010·Granted Jul 17, 2012·6 cites·25 claims
- 4986US8659113B2Embedded semiconductor die package and method of making the same using metal frame carrierSHIM IL KWON·Filed 2012·Granted Feb 25, 2014·5 cites·13 claims
- 5086US8163597B2Semiconductor device and method of forming no-flow underfill material around vertical interconnect structureHUANG RUI·Filed 2009·Granted Apr 24, 2012·12 cites·31 claims
Showing the top 50 of 149 patent records by PatentIndex Score.
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